NEC introduces three new ultra-miniature transistor packages

Santa Clara, CA -- NEC, the world leader in transistor packaging technology, has introduced three new packages for its silicon and silicon germanium products.

At just 0.84 x 0.64 x 0.4 mm (including leads), NEC's new 3-pin M33 is the smallest RF transistor package currently available in mass production quantities. The second package, NEC's new 6-pin TS, is designed to house NEC's popular twin transistor devices. At just 1.0 x 0.9 x 0.4 mm (including leads), it's the smallest twin-transistor package available. Developed for applications like VCO modules, the M33 and TS are both ideal for engineers faced with the task of miniaturizing their designs.

NEC will offer its highest performance silicon chips, the NE685, NE687 and NE851, in both of these new packages. NEC will also offer its NESG2106 SiGe transistor chip in the M33 and TS — the first time ever a high performance, SiGe transistor has been available in either a 3-pin or a twin transistor package.

NEC's third new package is the 6-pin M16. Developed specifically for NEC s high break-down voltage SiGe transistors, the M16 measures 1.2 x 1.0 x 0.5 mm (including leads) — over 80% smaller in volume than the SOT-343 packages usually used for these chips. It's ideal for amplifier applications to 6 GHz and oscillator circuits to 14 GHz and beyond.

All these devices are available now from California Eastern Laboratories .