MXPD70 Multicoax Test Solution Datasheet

The MXPD70 (“Multicoax Precision Direct”) series is a miniaturized, solderless multicoax test solution designed to address two key trends in the semiconductor industry: cost efficiency and height restrictions.

By eliminating the need for expensive connectors and operational soldering, MXPD70 assemblies reduce both material costs and assembly time, helping companies manage increasing internal budget pressures.

The MXPD70 assemblies operate at frequencies up to 70 GHz, making them ideal for High-Speed Digital Testing (HSDT), test and characterization boards, automated test equipment, and specialized customer applications. Both straight and right-angle configurations are available, providing sufficient clearance for heaters or coolers mounted directly above the device under test (DUT), while maintaining a dense 3.4 mm (0.134 in.) pitch to position assemblies close to the DUT and minimize trace lengths.

MXPD70 assemblies feature a solderless compression-mount interface, removing the need for PCB solder-down components. Their design supports superior signal integrity and data analysis rates up to 112 Gbps. The identical layout between straight and right-angle versions simplifies assembly replacement and reduces simulation efforts, while spring-loaded center pins and ground contacts eliminate the need for hard-gold plating on the PCB. Integrated swivel-mounted interface protection safeguards the assembly when disconnected, ensuring long-term durability and reliable operation.

With these capabilities, the MXPD70 series delivers a compact, cost-effective, and high-performance solution for semiconductor test environments, combining precise electrical performance with practical design features that accommodate both operational constraints and advanced high-speed testing requirements.