Murata Introduces Miniaturized SAW Duplexer For Wireless Communication Products
Creating a miniaturized SAW Duplexer is critical for wireless product manufacturers to meet consumers' continuing demands for smaller, lighter products. By upgrading the mounting method of the piezoelectric element from wire bonding to flip-chip construction, the SAW Duplexer's footprint was reduced 52 percent when compared to its predecessors. This new duplexer boasts measurements of 3.0mm x 2.5mm x 0.80mm.
In spite of the reduced footprint, the SAW Duplexer achieves higher isolation characteristics through the optimization of the piezoelectric element materials and the electrode design. Normally, isolation tends to deteriorate in a small package due to coupling between the internal elements. Murata addressed this typical relationship by incorporating a new simulation approach and revised structure to gain higher isolation while shrinking the package.
The reliability and power handling attributes are also improved in the new duplexer. The reliability increased because of the airtight design composition and improved thermal shock characteristics (HTS 1000 cycles). Power handling, generally considered difficult to co-exist simultaneously with the downsizing of the piezoelectric elements, was maintained through the improvement of the manufacturing methods and materials. Also, by incorporating Murata's own high power film formation process and advanced flip-chip construction, a warranted product life of 50,000 hours under an ambient temperature of 50 degrees Celsius at 1.0W is now possible.
"Murata's proven commitment to foster creative design techniques produces an ideal product for advanced wireless communications," said Scott Klettke, group product manager RF and microwave for Murata Electronics North America. "The improved SAW Duplexer benefits customers and consumers by providing improved functionality while reducing the package size."
SOURCE: Murata Electronics North America