Microwave MIC Assembly Services

Labtech Microwave offers a comprehensive build-to-print microwave module and component manufacturing service, which includes DFM support. Our microwave MIC production facility is housed in a class 10,000 clean room and accommodates ceramic thin film circuit manufacture, laser drilling, laser welding, automatic chip placement and wire bond assembly. In addition, Labtech Microwave has extensive microwave alignment and test facilities, which ensures a complete turnkey microwave assembly solution can be provided.

Manufacturing capabilities:

• Automatic chip & wire assembly
• Deep access wire bonding
• Wedge-wedge wire bonding
• Ball-wedge wire bonding
• Gold tapes for DC and RF Connections
• Eutectic attach of ceramic circuit to carrier
• Eutectic attach of high power devices
• Soft substrate and alumina assembly
• Thin film manufacturing
• Laser lid welding
• In-house rf machining and box build
• In-house microwave PCB manufacture
• In-house painting
• PCB and SMD assembly

Measurements available:

• Gain level and ripple
• Noise figure
• Input and output return loss
• Output power at 1dB gain compression
• Performance over temperature
• Harmonics
• Vector measurements
• Leak testing – fine and gross

Environmental testing & conditioning:

• Mechanical shock
• Mil-std vibration
• Temperature cycling
• Extended burn-in at elevated temperatures
• In accordance with mil-std 883

Quality and environment:

• ISO9001:2000
• ISO14001