Merrimac Industries, Inc.
Merrimac recently announced an innovative Multi-MixTM packaging technology and On-Line Co-DesignTM engineering modeling technique for commercial and military microwave components and subsystems. Surpassing conventional technology, the patent-pending 3-Dimensional, Multi-MixTM method is a unique process based on fluoropolymer composite substrates, for application to microwave, multilayer integrated circuits and micro-multifunction modules (MMFMTM) technology. Multi-MixTM microtechnology creates value, for example, by enabling filters, multiplexers, MMICs, and other active and passive circuits to be packaged individually or cascaded into supercomponents for mixer/pre-amplifiers, vector modulators, complex antenna feed-distribution networks, phased array beamformers or comparators for monopulse receiving systems.
Building for future applications where "value" is the key driver, Merrimac has embarked on an intensive campaign of "value engineering" a whole new family of products suited for emerging systems and technology of tomorrow. With Management and Co-workers absolutely committed to Total Engineering And Manufacturing Solutions (TEAMS), it's assured Merrimac will be supplying "Tomorrow's Components Today"!
Merrimac Industries, Inc., with locations in West Caldwell, NJ and San Jose, Costa Rica, and, as a result of its recent acquisition of Filtran Microcircuits Inc., Ottawa, Ontario, Canada, an industry leader in gold plating of high-frequency microstrip, bonded stripline and thick metal-backed Teflon (PTFE) micro circuitry, has approximately 220 co-workers in the design and manufacture of signal processing components, micro-multifunction modules (MMFM™) and subsystems providing Total Integrated Packaging Solutions for high-performance, mission-critical applications in communications, defense, and aerospace markets. Merrimac (MRM) is listed on the American Stock Exchange.