The CMD157 is a die LNA MMIC suitable for chip-and-wire applications. The CMD157P3 is a packaged LNA MMIC, housed in a leadless RoHS compliant 3x3 mm plastic surface mount package. Both deliver greather than 25 dB of flat gain, and have no need for external DC blocks or RF port matching.
These LNAs are much smaller, lower-cost alternatives to hybrid amplifiers in this frequency range. Ideally suited for broadband EW and communication systems, where small size and low power consumption are needed, the CMD157 and the CMD157P3 can also be used in low noise downconverters, microwave radio receiver systems, and radar receivers.