Laminate For RF And Microwave Printed Circuit Boards: AD300C
Source: Arlon Materials for Electronics
Arlon's AD300C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. This ceramic-filled, woven fiberglass reinforced PTFE composite material is built on a cost-effective construction of unique chemistry formulation and processing to offer RF and Microwave designers an advantage for improving electrical and mechanical performances without the additional cost traditionally associated with higher performance. AD300C provides a significant improvement in cost/ performance over the existing AD300A product line and other traditional fluoropolymer-glass laminates.
The Next Generation of AD300A with Improved Performance and Cost for RF/Microwave Applications
AD300C is ideal for Base Station Antennas and Base Station Power Amplifiers where low loss and low PIM is critical. Other key features include low moisture absorption, lowest in class TCEr (-25ppm/°C) and very low CTExyz (9, 15 and 54ppm/°C, respectively), high copper peel strength and good dimensional and thermal stability. Its Dielectric Constant 2.97 and tighter DK tolerance (±0.05) is desired for achieving high antenna efficiency and large bandwidth, and also provides a small degree of miniaturization that is critical to the size constraints of some antenna designs. Its lowest-in-class TCEr helps antenna designs to maintain high antenna gain and performance over wider operating temperature ranges by minimizing resonance frequency shift and bandwidth roll off at the temperature swings.
AD300C is compatible with the processing used for standard PTFE based printed circuit board substrates. In addition, the low Z-axis thermal expansion provided by the ceramic loading, will improve plated through-hole (PTH) reliability compared to typical PTFE based laminates.
Excellent Thermal Coefficient of Dielectric Constant (TCEr=-25ppm/°C)
Excellent PIM Performance
High Thermal Conductivity ideal for Higher Power Designs
Reduced Coefficient of Thermal Expansion in z-direction (CTEz)
Cost-Effective Advanced Material for Commercial RF Applications and High Volume Manufacturing Design
Tightest Commercial Laminate DK Tolerance for Impedance Control
Low Dielectric Loss (Loss Tangent)
Low Insertion Loss (S21)
Excellent Electrical Phase Stability vs. Temperature
Excellent Copper Bond Strength
Low Moisture Absorption
Base Station Antennas
Power Amplifiers (PA), Tower Mounted Amplifiers (TMA) and Tower Mounted Booster Amplifiers (TMB)