Keragis Launches Solid-State, High-Power TWT Replacement Modules


Due to its size, losses within the unit are small so the unit operates with better efficiency. Since there are numerous MMICs or FETs within the unit, single point failures are minimized and thus failures become "soft failures," only reducing the power slightly when one device fails. A technique is used (patent pending) that eliminates the so-called "zipper effect" which, in some amplifiers, can cause failure of all devices if one device fails.
Control and power for the unit are provided by solder or connector pins. Some monitoring within the unit can be accomplished through the control system. The input and output RF connectors can be on the same side of the unit or opposite sides depending on end user requirements. Several of these modules can be put together with external combiners to provide larger outputs.
A narrow band module is also available that will provide typically >80 Watts output. Additionally, a pulsed design has been completed that will provide up to 150 Watts.
SOURCE: Keragis Corporation