Introducing MXPD70: The Next Step In Multicoax Test Solutions

By Juerg Nussbaumer, Product Manager, IND RF Product Management Cable Connectivity

As semiconductor testing grows more complex and performance demands increase, engineers face mounting pressure to deliver high-speed, high-density test solutions while managing cost and space constraints. A new generation of multicoax test assemblies is addressing these challenges with innovative, connector-less design approaches.

This miniaturized, solderless multicoax solution eliminates the need for traditional PCB-mounted connectors, reducing both material costs and assembly time. By removing soldering from the process, it also simplifies manufacturing workflows and minimizes potential points of failure, improving overall reliability.

Designed to support frequencies up to 70 GHz and data rates aligned with high-speed digital testing requirements, these assemblies deliver strong signal integrity for advanced semiconductor validation and characterization. Their compact footprint allows closer proximity to the device under test (DUT), enabling more accurate measurements in dense test environments.

A key advantage is flexibility in constrained setups. With both straight and right-angle configurations available, the assemblies accommodate height limitations caused by thermal management systems such as heaters and coolers positioned above the DUT. This adaptability is critical for modern test environments where space is at a premium.

Additional design features, including compression-mounted interfaces and spring-loaded contacts, further enhance durability and ease of use while reducing PCB complexity.

By combining cost efficiency, compact design, and high-frequency performance, this multicoax solution supports the evolving needs of semiconductor testing, enabling faster, more reliable, and scalable test system development.