White Paper: Improvements In Microwave Laminates For Power Amplifier Reliability And Efficiency

By George Qinghua Kang, Michael T. Smith, John C. Frankosky, Arlon Materials for Electronics

Demands for higher data rates and capacity have continued to drive RF and microwave electronics continue toward higher frequency and higher power requirements. These power and frequency demands have increased the heat burden on power amplifiers and related electronics while competing requirements have pushed to reduce device size and weight while exposing electronics to greater environmental conditions. The resulting combination has been a decrease in overall efficiency resulting in higher operating temperatures and a resulting decline in reliability.