White Paper: Improvements In Microwave Laminates For Amplifier Reliability And Efficiency
Source: Arlon Materials for Electronics
Trends in the electronic industry continue to drive materials to satisfy higher power and higher thermal stability requirements. Many techniques have been developed to improve heat rejection in electronics, including engineered heat sinks, thermal interface materials, and whole subsystems (cooling fans and heat pipes). This pursuit has extended to RF and microwave circuit board substrate materials.
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