Catalog | September 15, 2011

Hybrid Microelectronics Packages Catalog

Source: Mini-Systems, Inc.

Founded in 1972, Mini-Systems, Inc., Electronic Package Division has been providing the electronics industry with the very highest quality hybrid microelectronic packages available. The Electronic Package Division is best known for supplying the hybrid alternative to plastic microelectronic packages; namely, our Alumina/Glass Sidewall packages. These packages meet military and space level quality requirements and exceed virtually all commercial needs.

access the Catalog!

Get unlimited access to:
Trend and Thought Leadership Articles
Case Studies & White Papers
Extensive Product Database
Members-Only Premium Content
Welcome Back! Please Log In to Continue. X

Enter your credentials below to log in. Not yet a member of RF Globalnet? Subscribe today.

Subscribe to RF Globalnet X

Please enter your email address and create a password to access the full content, Or log in to your account to continue.

or

Subscribe to RF Globalnet

Please tell us more about you so that we can customize our newsletters to your specific interests:

Mini-Systems, Inc.