Product/Service

GPPO™ Interconnect Series

Source: Corning Gilbert Inc.
A sub-miniature, push-on, high performance, microwave interconnect system
A sub-miniature, push-on, high performance, microwave interconnect system. Developed in response to industry demand for increased package density, lower weight, and performance at higher frequencies.

  • Center-to-center spacing of 0.135" available for increased package density.
  • The GPPO™ blindmate interconnect, Part No. B1B1-0001-01 weighs just 0.09 grams.
  • RF Performance from DC to 65 GHz
  • Designed to accommodate both radial and axial misalignment with negligible VSWR change.
  • Adapters available to SMA, 2.4mm. and 1.85mm.

Click here to download the complete brochure in PDF Format.

Click Here To Download:
•Product Catalog: Microwave Push-On Interconnects

Product Pages:
The following are examples of many product listings that Corning Gilbert offers.