Product/Service

GPO™ Interconnect Series

Source: Corning Gilbert Inc.
A sub-miniature, push-on, blindmate, high performance microwave and RF interconnect system
A sub-miniature, push-on, blindmate, high performance microwave and RF interconnect system. Developed in response to industry demand for increased package density.

  • Center-to-center spacing of 0.170" available for increased package density.
  • The GPO™ blindmate interconnect, Part No. A1A1-0001-01 weighs just 0.17 grams.
  • RF Performance from DC to 40 GHz
  • Designed to accommodate both radial and axial misalignment with negligible VSWR change.
  • A full range of adapter support.
  • Snap together mate for reduced assembly and test time.
  • Complies with SMP interface of MIL-STD-348 in accordance with MIL-PRF-39012, DESC 94007/94008

Click Here To Download:
•Product Overview: GPO™ Interconnect Series
•Product Catalog: Microwave Push-On Interconnects

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