News | October 15, 2008

Gore Introduces Copper Cable Assemblies As Alternative To Fiber Optic Modules

Source: W. L. Gore & Associates
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Landenberg, PA - W. L. Gore & Associates, Inc., (Gore) has drawn on its expertise in electronic cable design to develop the new GORE SFP+ Copper Cable Assemblies for the high-performance computing (HPC), enterprise networking and network storage markets. These cable assemblies offer a more reliable, efficient and economical alternative to fiber optic modules for transmitting 10 Gbps data at distances up to 25 meters. GORE SFP+ Copper Cable Assemblies comply with the SFF-8431 standard while providing reduced jitter, a very low latency, and a maximum signal eye opening. According to Herb Vandeusen, Gore's product specialist for GORE™ SFP+ Copper Cable Assemblies, "Our SFP+ copper cable assemblies have been proven to be a cost-effective solution to high-performance computing applications, specifically in the 10 Gigabit Ethernet and 8G and 10G fibre channel markets."

GORE SFP+ Copper Cable Assemblies provide the highest performance with a lower dielectric constant, lower loss, tighter impedance control, and a wider bandwidth. Through the use of a proprietary expanded PTFE dielectric, Gore achieves a smaller cable size for a given conductor or a larger conductor in a specific twinax diameter. These cables are completely RoHS-compliant, even with some exemptions that have been recently eliminated. The connector is made with a high-performance, low-loss RF material to reduce dielectric loss and provide a higher degree of impedance control through the link as well as reduced crosstalk compared to lossy FR-4 designs.

The GORE SFP+ Copper Cable Assembly is the latest addition to Gore's line of products for high-performance digital interconnects, which includes DDR and QDR Infiniband, GbX, AIRMAX VS, and ERmet ZD cable interconnects. These cable assemblies are being adopted by major original equipment manufacturers.

SOURCE: W. L. Gore & Associates