Gore Introduces Board-Level Shield For PCB Design Engineers

As electronic devices reduce in size, and the demand for more features increases, designing printed circuit boards becomes more complex.

Now you can design the board based on circuit and component function without the constraints imposed by the shape of traditional shielding cans.

GORE™ SNAPSHOT® Board-Level Shield is a multi-cavity, thermoformed solution that allows design engineers to place components and circuits on a PCB based on function, without the need to conform to the predefined geometry of the shield. A single thermoformed shield provides many advantages, resulting in increased flexibility in board design, integration, and performance.

SOURCE: W. L.Gore & Associates