Glass Microwave Integrated Circuit (GMIC)

Glass Microwave Integrated Circuit (GMIC) is a novel circuit fabrication technology. It provides many advantages of GaAs MMICs whilst retaining the desirable performance characteristics of hybrid MICs. GMIC Offers:

• Excellent Microwave Performance
• Integrated Passive Elements – R, C, & L
• Accepts all types of active devices.
• Compatible with Auto Assembly & Test.
• Excellent Thermal Management
• Predictable performance in volume.
• Small Size and Low cost.

GMIC Applications – 900 MHz to 100 GHz

Versatility and Reliability:

• VCOs
• Amplifiers
• Mixers
• Control Devices
• Passive Components
• Subsystems

For use in the following:

• Imaging Radar (Airport Body Scanners)
• Missile Frontend Assemblies
• AESE, Active Antenna components

GMIC technology is a wafer-level, photolithographic; batch process oriented manufacturing technology, in which a large number of circuits can be fabricated on each wafer. It comprises a thin glass substrate bonded to a high conductivity silicon carrier, forming a composite wafer with RF capacitors, inductors, conductors, air-bridges and plated via holes defined on the thin glass substrate.

Technology Comparison

GMIC is an extremely reproducible fabrication technology capable of producing high performance microwave components for critical applications: the small number of wire bonds greatly enhances reliability. The great strength of GMIC is as an integration medium and as an enabling technology for MMIC.