White Paper

GaN IC Die Handling, Assembly, And Testing Techniques

Source: Northrop Grumman Microelectronic Products & Services

GaN IC chips are usually delivered to the end user as individual chips stored in plastic chip trays or Gel-Pak. This white paper describes the storage and handling requirements for GaN IC chips, as well as recommended assembly and testing techniques for users. Guidelines are also provided to aid the user in the assembly of GaN IC die in a manner consistent with desired electrical performance. Download the full paper for more information.