Eutectic Die-Attach Method Of GaN And GaAs MMICs

This white paper reviews the many challenges to overcome when developing a repeatable eutectic die-attach process, including avoiding contamination, ensuring the quality of the pickup collets, and balancing efficiency and accuracy during screening procedures. The paper also details the key factors in determining if a eutectic die-attach process is sophisticated enough to serve the mission-critical applications of today’s aerospace, military, Satcom, and telecommunications applications. Download the full paper for more information.