Encapsulation Dispensing MRSI 175 ENCore

The MRSI 175 ENCore Dual Lane Encapsulation System brings flexibility and performance to the most demanding encapsulation applications — delivers the highest flow rates, the best volumetric control and the lowest cost of ownership. It offers dual lane, parallel processing conveyors for continuous dispensing, can be configured with advanced thermal processing systems, and has a user-friendly yet powerful customized Windows NT® operating system. Its dual dispense heads (including a dual chamber linear positive displacement — LPD — pump), vision alignment, and enhanced features such as automatic needle calibration make the ENCore the world leader in encapsulation, BGA dam and fill, and underfill.

ADVANTAGES:

• Continuous dispensing (no refill time between shots) for high throughput True, precise and repeatable volumetric dispensing minimizes process errors
  
• Interchangeable chamber sizes for application-specific needs for maximum flexibility
  
• Parallel Processing Conveyors
  Eliminates lost time due to substrate pre-heat and post-heat, and substrate load and unload, thereby increasing manufacturing efficiency
  
• Thermal Management
  Heated syringe chamber, heated dispense needle and heated substrate platform for pre and post heating, result in enhanced process control
  
• Large Material Reservoir
  Increased time between replenishment, minimizing calibration time and system downtime - Up to 32 oz. cartridge handling capability
  
• Modular Design
  Multiple cells may be combined into an integrated process line to meet virtually any throughput

MRSI, 101 Billerica Avenue, Bldg. 3, North Billerica, MA 01862-1256. Tel: 978-667-9449; Fax: 978-667-6109.