EMI Shielding & Grounding Solutions

Gore offers a variety of EMI gaskets, grounding pads, and board-level shields with low DC resistance and up to 90 dB of shielding effectiveness. These materials are suitable for the most demanding applications including portable headsets, wireless base stations, and power amplifiers. GORE™ snapSHOPT™ Board-Level EMI Shield is a multi-cavitiy, space-saving, geometrically flexible shielding solution. It is ideally suited for providing shielding for today's complex, highly-functional wireless devices. Our GORE-SHIELD® SMT EMI Gaskets and grounding Pads are unique electrically conductive interface solutions that are compatible with the pick-and-place process and reflow solder to the printed circuit board. GORE-SHIELD® EMI Gaskets offer lower DC resistance then metal shim gaskets. Because they can be die-cut into nearly and shape, they allow more design flexibility than traditional soldered metal cans.

Detailed information is available.