By Xavier Lecoq and Damien Rousseau, ANSYS
Designs for high-performance electronics systems, including chip-package-board and mechanical surrounding, have increased in complexities, and complying with EMI/EMC standards has become challenging. With some issues, fixing the EMI/EMC problems requires a product redesign that delays mass-production. This white paper challenges the achievements in the development of a new simulation methodology to estimate, investigate and address radiated EMI/EMC/Co-existence issues. Download the full paper for examples of possible RF interferences, an introduction to IME/EMC standards, and an overview of the ANSYS EMI/transient co-simulation flow and design methodology.