Emerson & Cuming Announces B-Stageable Lid Seal Adhesive For Assembly Processes

Billerica, MA -- A new B-stageable dielectric adhesive from Emerson & Cuming enables the decoupling of the dispense and the assembly process. Emerson & Cuming's E-1470 can be dispensed (as required for your application), B-staged, and stored for up to 3 months prior to cure. The psuedoplastic properties of the wet paste adhesive prevent slumping prior to or during the b-stage process. Following B-stage, the material can be cured in just 5 minutes at 180°C.

Emerson & Cuming's E-1470 is suitable for difficult to bond substrates, especially LCP, Ceramic and Gold. This adhesive was originally designed for transistors in base stations but it can be used in a variety of mechanical attach applications. It has been tested to pass gross leak requirements and can be used in the sealing of a hermetic package.

This technology helps address the application challenges associated with wet adhesives, small or complex parts, long cure times and adhesion challenges.

SOURCE: Emerson & Cuming