White Paper

Designing Multiconductor RF Backplane Connectors For Embedding Computers

Source: TE Connectivity

By Steve Morley, TE Connectivity

Technological advancements such as RF signal processing, integrated electronics, and miniaturization of interconnects have helped radar systems become the active electronically scanned array systems we have today. These RF advancements have also provided the building blocks for today’s highly agile radar and high-speed embedded communications systems that are now smaller, more sophisticated, and open-architecture with a larger number of interconnections into the high-density arrays.

The modularity of these embedded systems along with the need to integrate RF functionality created the opportunity to make a separable RF daughtercard/backplane interface within the system architecture that can simplify RF signal routing and eliminate the need for front panel RF cable jumpers. With this new interface, there is a need for a standardized framework for the application of multiple RF blind-mate coaxial interconnects. This white paper discusses the ANSI/VITA 67 Standard for Coaxial Interconnects on VPX, and how it pertains to designing multiconductor RF backplane connectors for embedding computing.

access the White Paper!

Get unlimited access to:

Trend and Thought Leadership Articles
Case Studies & White Papers
Extensive Product Database
Members-Only Premium Content
Welcome Back! Please Log In to Continue. X

Enter your credentials below to log in. Not yet a member of RF Globalnet? Subscribe today.

Subscribe to RF Globalnet X

Please enter your email address and create a password to access the full content, Or log in to your account to continue.

or

Subscribe to RF Globalnet