Custom Manufacturing Of Multilayer Mixed Dielectric PCB For The Aerospace/Defense Industry
Source: Standard Printed Circuits, Inc.
Standard Printed Circuits manufactured this multilayer mixed-dielectric printed circuit board (PCB) for the aerospace/defense industry with the customer's specifications and requirements determining the materials used. Innerlayers were drilled, imaged, etched, then pressed into panels using low Dk bonding films during the lamination process.
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•Multilayer Mixed Dielectric PCB Specifications
•Multilayer Mixed Dielectric PCB Specifications
•Multilayer Mixed Dielectric PCB Specifications
Once lamination and cool-down were complete, the panels had all primary holes drilled. The panels were processed through Plasma and Sodium etching to prepare for Direct Metallization.
Click Here To Download:•Multilayer Mixed Dielectric PCB Specifications
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