News | May 24, 2005

CeramTec Expands Aluminum Nitride Substrate Capabilities

Laurens, SC -- CeramTec announced that Alunit (aluminum nitride) substrates with "as fired" surface finishes are now available for a broad range of thin-film and thick-film applications. The recently expanded Alunit capabilities include tape cast thicknesses from .010" to .060" with large size capabilities up to 5.4" by 7.4". According to CeramTec, this is the thinnest and largest "as fired" aluminum nitride substrate in the industry.

In their "as fired" finish, these cool-running ceramic components are ideal for electronic systems that host cost-effective components and hybrid parts in high-density designs. Their robustness and low thermal coefficient of expansion delivers reliable and trouble-free systems integration. Suggested applications include power electronics, IGBT modules, telecom systems, cooling devices, direct copper bonding (DCB), and LEDs.

Alunit components provide exceptional power insulating benefits. The aluminum nitride ceramic features extremely high heat conductivity; its minimum of ~180 W/mK is 10 times greater than conventional aluminum oxide materials.

Other features include improved printing and excellent polishability. CeramTec maintains Alunit inventories in the U.S. to assure fast turnaround and reduced lead times.

Source: CeramTec