C-MAC MicroTechnology
Because C-MAC MicroTechnology's customers include many of the world's leading telecom, automotive, military, aerospace and wireless communications manufacturers, it operates to exacting product and service standards. These standards are driven by a company-wide culture of continuous operational improvements to enhance its ability to meet and exceed the ever-expanding expectations of its customers.
One of C-MAC MicroTechnology's greatest strengths is the ability to cater its broad range of leading edge technological capabilities to specific customer requirements. These capabilities include industry-leading design and manufacturing expertise in advanced electronic components, sub-systems, and systems allied with best-in-class customer service, manufacturing and engineering techniques.
Frequency Products
A powerful and complementary C-MAC MicroTechnology design and manufacturing capability stems from its market-leading array of precision frequency control products that satisfy the needs of the communications, commercial, industrial, and military markets. CMAC's history with quartz crystal products spans over 60 years and is comprised of six, ISO9001 certified, design and manufacturing centers worldwide.
The range of products produced features AT and SC cut Quartz Crystals, Crystal Oscillators (XOs), Voltage Controlled Oscillators (VCXOs), Temperature Compensated Oscillators (TCXOs), and Oven Controlled Oscillators (OCXOs), that are available in SMD and/or leaded packages to suit the application. C-MAC's leading-edge frequency control products include:
- TCXOs with ASIC temperature compensated stabilities up to +/-0.3ppm
- OCXOs with ASIC temperature compensated stabilities up to +/-2.5x10E-11
- Stratum 3, 3E, SMC, and Stratum 4 Reference Oscillators
- SONET/SDH VCXOs and Oscillators, up to 666 MHz (and higher)
- Quick-Turn 5x7 mm SMD Clock Oscillators, available in 1 week
Microcircuits
C-MAC MicroTechnology has nine microcircuit manufacturing operations designing and producing a wide range of functional modules for use in telecommunications, wireless and automotive systems. Facilities at Sherbrooke in Canada, Great Yarmouth in the UK, West Palm Beach, FL, USA, Evreux in France, Ronse in Belgium, Bangalore in India, and Sonjiang in China produce thick-film substrates, surface-mount hybrid circuits, direct-attach flip-chip and power conversion modules. Low-temperature co-fired ceramic (LTCC) and multichip module (MCM) assemblies are the specialty at Villingen in Germany and Costa Mesa, CA, USA.
All of these resources are complemented by an integrated design-to-test service encompassing ASIC design as well as analogue, digital, mixed-mode and thermal simulation.
C-MAC MicroTechnology's greatest strength is its ability to "mix and match" within its broad technology portfolio to deliver modular, fully tested solutions tailored to the needs of individual OEMs. In this way it seeks to deliver complete enabling solutions for technologies, such as broadband Internet and the Bluetooth wireless interface, that is shaping the future.
In the past 5 years emphasis has been devoted to the development of a comprehensive range of databus products, now in widespread use in the US and Europe. This field has been expanded with the development of high-speed databus systems in both electrical and fibre-optic configurations. The growing demand for high data rate telecommunication systems and RF communication products has driven both substrate and high-speed assembly technology.
It is C-MAC MicroTechnology's policy to provide customers with products and services that exactly meet their requirements. An ongoing improvement program ensures that this standard embraces the philosophies, tools and techniques of Total Quality Management.
Microelectronic Assembly
Once a circuit has been produced, C-MAC offers a range of advanced, high speed pick and place machinery to assemble to any substrate by placing components into screen deposited solder paste. The interconnect board is then reflowed in a conveyor reflow oven, or if required, can be connected to lead frames with automatic lead attachment and soldering equipment. All our assembly facilities employ full electrostatic discharge (ESD) protection programs to protect components before, during and after the manufacturing cycle. Traditional chip and wire, globtop assembly is also available, as is flip-chip technology.
For lower volume production requirements, C-MAC has a dedicated manual assembly department, offering a diverse range of skills specific to the needs of prototype or short production run assemblies, where the use of automated tooling would introduce unnecessary time delays and costs.
Low-temperature Co-fired Ceramic (LTCC)
C-MAC has two facilities specializing in the manufacture of substrates using co-fired tape technology known as Low Temperature Co-fired Ceramic (LTCC). This technology is extremely useful in a diverse range of applications including high volume automotive and specialist high frequency products. Its primary advantage is to enable substrate manufacture that incorporates cavities, custom shapes, integrated passives, and interlayer connection to offer very high-density circuit designs.
C-MAC MicroTechnology has developed an LTCC assembly system that offers zero shrinkage during manufacture. The tape itself is made to C-MAC's own exacting specification within our own plant. Tapes from other manufacturers are used where required by customer specification. C-MAC's co-fired tape system provides the ability to have components buried between tape layers thus providing minimum lead length and further reductions in circuit geometry.
Because substrates manufactured using the co-fired technique can be processed using the same methods as standard alumina substrates once they have been fired, laser trimming of resistors and circuit singulation using sophisticated dicing technology are all available design opportunities.
Waveguides and Passive Components
The acquisition of GHz Technologies, a designer and manufacturer of passive microwave filters and other components, and T.Q.F. (Total Quality Finishing) Technologie, a related business that provides specialized plating of gold and silver on various microwave and wireless components, complements C-MAC's capability in Low Temperature Co-fired Ceramic (LTCC) substrates. Products include:
- Filter sub-assemblies
- Waveguide filters (bandpass, transmit reject, receive reject, harmonic reject).
- Waveguide couplers (broadwall directional, narrow wall directional, cross guide directional, hybrid)
- Waveguide terminations (high power, medium power, low power, precision)
- Waveguide adapters (tapered transitions)
- Many specialised components and sub systems (bandpass filter, cavity filter, manifold assembly 8GHz
- manifold assembly 15GHz, manifold assembly 18GHz, manifold assembly 23GHz
- Waveguide combining networks (diplexers, orthomode couplers)
- Waveguide ferrite devices (circulators, isolators)
- Ferrite devices (coaxial circulators and isolators)
- Coaxial filters, Coaxial couplers, Coaxial dividers and combiners.