Bourns Releases LTCC Band Pass Filters For 5G C-Band RF Front-End Designs

Compact LTCC multilayer construction integrates passive elements into a single monolithic structure for high-frequency wireless communication equipment.

Bourns today announced the Model FBP1604N470L3, FBP1608N375L3, and FBP2007N470L3 LTCC (Low-Temperature Co-fired Ceramic) band pass filters. These multilayer ceramic RF components are designed for high-frequency applications operating across frequency ranges from 3300 MHz to 5000 MHz and support deployment within the 5G C-band spectrum. By integrating multiple passive elements into a single monolithic structure, the filters provide compact component options for RF front-end designs where board space and frequency coverage are primary design considerations.

RF front-end designs for 5G equipment require filtering components that fit into compact layouts while maintaining defined frequency response and insertion loss limits. LTCC technology integrates passive elements into a ceramic multilayer structure, supporting slim, compact, and reliable microelectronic designs. The three FBP models cover 3300 MHz to 4200 MHz and 4400 MHz to 5000 MHz frequency ranges, with maximum insertion loss ratings from 0.9 dB to 1.7 dB at +25 °C depending on the model. The products support operating temperatures from -40 °C to +85 °C, with the FBP2007N470L3 model specified from -40 °C to +105 °C.

“RF front-end designers selecting filters for 5G designs need frequency coverage, compact package dimensions, and insertion loss values that can be checked directly against the circuit requirements. The FBP Series LTCC Band Pass Filters combine multilayer ceramic construction with frequency ranges across 3300 MHz to 5000 MHz and compact package sizes down to 1.6 x 0.8 x 0.35 mm. These specifications give designers a documented filter option for eMBB, Fixed Wireless Access, and private 5G network deployments.” — Edward Liu, Product Line Manager, Bourns.

Design Features and Key Capabilities

• Low-Temperature Co-fired Ceramic (LTCC) — integrates multiple passive elements into a single monolithic ceramic structure to support compact microelectronic designs
• Compact size — supports board layouts requiring small RF components, with package sizes of 1.6 x 0.8 x 0.35 mm, 1.6 x 0.8 x 0.4 mm, and 2.0 x 1.25 x 0.65 mm
• RoHS compliant^* — meets the RoHS compliance statement listed in the product data sheets

Electrical Specifications (TA = 25 °C)

Applications

• 5G C-band RF front-end designs — supporting enhanced mobile broadband (eMBB), Fixed Wireless Access (FWA), and private 5G network deployments

Availability and Ordering
The FBP1604N470L3, FBP1608N375L3, and FBP1604N470L3 LTCC diplexer is available now through Bourns’ authorized distribution network. Full specifications and ordering information are available at FBP1604N470L3, FBP1608N375L3, and FBP1604N470L3. Samples may be requested through Bourns Customer Service.

About Bourns
Bourns is a privately held manufacturer of power electronics, resistive components, circuit protection, and sensing solutions. Founded in 1947 and headquartered in Riverside, California, Bourns serves the automotive, industrial, consumer, communications, healthcare^†, and audio markets through a global network of design, manufacturing, and sales operations. For more information, visit bourns.com.

^*RoHS Directive 2015/863, Mar 31, 2015 and Annex.

^† Bourns products have not been designed for and are not intended for use in "lifesaving," "life-critical" or "life-sustaining" applications nor any other applications where failure or malfunction of the Bourns product may result in personal injury or death. See Legal Disclaimer Notice www.bourns.com/docs/legal/disclaimer.pdf