Applied Materials and Ericsson Collaborate on Semiconductor Development

Applied Materials, Inc.croelectronics is working with <%=company%> (Santa Clara, CA) to develop multisystem Process Module technology that will be used to fabricate Shallow Trench Isolation (STI) structures on Ericsson's 0.25 µ and 0.18 µ advanced RF (radio frequency) devices for telecommunication chips.

Process modules are pre-integrated groups of systems that function together to perform a specific process sequence used in manufacturing of semiconductor devices. The STI Process Module technology will use Applied Materials' Silicon Etch DPS Plus Centura, Ultima HDP-CVD Centura and Mirra Mesa CMP (chemical mechanical polishing) systems. Ericsson's process engineers are currently working with Applied Materials technologists to customize STI Process Module technology for Ericsson's RF processes, prior to the systems shipment to Sweden.