3-D RLC Extraction Solution for RF Designs from Sequence

Sequence Design Inc. (Santa Clara, CA) has released Columbus-RF, the industry's first integrated 3-dimensional RLC interconnect extraction solution specifically tailored for RF, analog and custom high-speed digital integrated circuit (IC) designs. Columbus-RF leverages Sequence's patented Exact Topological Decomposition architecture, which accounts correctly for how a target net interacts with all other nets and not just with its nearest neighbors.

With the high frequencies found in today's RF and high-speed digital designs, interconnect parasitic effects, including inductance, are a critical performance determinant and cannot safely be ignored. Columbus-RF brings powerful new innovations to RF designs, including accurate resistance-capacitance (RC) modeling, the ability to model inductance (L) in RF circuits, and tight, on-line integration with Cadence Design Systems Analog Artist environment and Diva physical verification tools.

RF and custom high-speed digital designers generally follow a much more interactive design and physical verification style than traditional ASIC designers. These designers benefit from Columbus-RF's on-line integration with Cadence's Analog Artist / Diva design flow. The integration provides the interactivity consistent with the requirements of this design approach, enabling designers to add 3D RLC extraction to their design flows without impact to their productivity or design methodology.

Edited by Gregg Miller