Laminates

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AD450: RF & Microwave Laminate

AD450: RF & Microwave Laminate

Arlon’s AD450 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It can be specified to replace Arlon AR450, a composite with similar electrical properties, but based on non-woven fiberglass reinforcement.
IsoClad: RF & Microwave Laminates

IsoClad: RF & Microwave Laminates

IsoClad laminates are nonwoven fiberglass/PTFE composites for use as printed circuit board substrates. The nonwoven reinforcement allows these laminates to be used more easily in applications where the final circuit will be bent to shape. Conformal or “wrap-around” antennas are a good example
CuClad: RF & Microwave Laminates

CuClad: RF & Microwave Laminates

CuClad® laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precision control of the fiberglass/PTFE ratio, CuClad laminates offer a range of choices from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability
CLTE: RF & Microwave Laminate

CLTE: RF & Microwave Laminate

CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.
AD1000: High Dielectric Constant Laminate

AD1000: High Dielectric Constant Laminate

AD1000 is a high dielectric constant substrate that permits circuit miniaturization compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.
Laminate For RF And Microwave Printed Circuit Boards: AD255C

Laminate For RF And Microwave Printed Circuit Boards: AD255C

Arlon’s AD255C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD255C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
MultiClad: Low-Loss Multilayerable Laminate

MultiClad: Low-Loss Multilayerable Laminate

Arlon’s MultiClad HF is a new halogen-free low-loss system that represents the next generation in low-loss multilayerable thermoset laminate and prepreg systems for microwave and high-frequency printed circuit boards. This new multi-purpose PWB material technology combines a ceramic-filled low-loss, high reliability thermoset resin system with bromine-free flame retardant system to create a material that is unmatched in terms of environmental standards, electrical performance, mechanical stability, thermal reliability and cost.

AD350A: RF & Microwave Laminate

AD350A: RF & Microwave Laminate

Arlon’s Next Generation "AD350A" is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate.
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