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AD450: RF & Microwave Laminate
Arlon’s AD450 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It can be specified to replace Arlon AR450, a composite with similar electrical properties, but based on non-woven fiberglass reinforcement.
Laminate Composites For RF/Microwave Applications
Arlon Microwave Materials specializes in products made from fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, ceramic-filled hydrocarbon thermosets, and other materials that deliver the electrical performance needed in frequency-dependent circuit applications. These products are supplied as copper-clad laminates with bonding plies, or prepregs, for production of multilayer printed circuits. Arlon has over "50 years of experience in microwave materials", today providing products that are used to make combiner boards and feed networks for microwave applications as well as basestation antennas and power amplifier boards for the wireless telecommunications infrastructure market.
IsoClad: RF & Microwave Laminates
IsoClad laminates are nonwoven fiberglass/PTFE composites for use as printed circuit board substrates. The nonwoven reinforcement allows these laminates to be used more easily in applications where the final circuit will be bent to shape. Conformal or “wrap-around” antennas are a good example
Laminate For RF And Microwave Printed Circuit Boards: AD250C
Arlon’s AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
AD350A: RF & Microwave Laminate
Arlon’s Next Generation "AD350A" is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate.
CLTE: RF & Microwave Laminate
CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.
CuClad: RF & Microwave Laminates
CuClad® laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precision control of the fiberglass/PTFE ratio, CuClad laminates offer a range of choices from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability
PIM Series: Passive Intermodulation Laminates
Arlon’s reduced Passive Intermodulation (PIM) laminates are a series of woven fiberglass reinforced Teflon (PTFE) composite materials designed for use as printed circuit laminates.
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