Laminates

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Laminate Composites For RF/Microwave Applications

Laminate Composites For RF/Microwave Applications

Arlon Microwave Materials specializes in products made from fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, ceramic-filled hydrocarbon thermosets, and other materials that deliver the electrical performance needed in frequency-dependent circuit applications. These products are supplied as copper-clad laminates with bonding plies, or prepregs, for production of multilayer printed circuits. Arlon has over "50 years of experience in microwave materials", today providing products that are used to make combiner boards and feed networks for microwave applications as well as basestation antennas and power amplifier boards for the wireless telecommunications infrastructure market.
MultiClad: Low-Loss Multilayerable Laminate

MultiClad: Low-Loss Multilayerable Laminate

Arlon’s MultiClad HF is a new halogen-free low-loss system that represents the next generation in low-loss multilayerable thermoset laminate and prepreg systems for microwave and high-frequency printed circuit boards. This new multi-purpose PWB material technology combines a ceramic-filled low-loss, high reliability thermoset resin system with bromine-free flame retardant system to create a material that is unmatched in terms of environmental standards, electrical performance, mechanical stability, thermal reliability and cost.

Laminate For RF And Microwave Printed Circuit Boards: AD300C

Laminate For RF And Microwave Printed Circuit Boards: AD300C

Arlon’s AD300C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. This ceramic-filled, woven fiberglass reinforced PTFE composite material is built on a cost-effective construction of unique chemistry formulation and processing to offer RF and Microwave designers an advantage for improving electrical and mechanical performances without the additional cost traditionally associated with higher performance. AD300C provides a significant improvement in cost/ performance over the existing AD300A product line and other traditional fluoropolymer-glass laminates.
PIM Series: Passive Intermodulation Laminates

PIM Series: Passive Intermodulation Laminates

Arlon’s reduced Passive Intermodulation (PIM) laminates are a series of woven fiberglass reinforced Teflon (PTFE) composite materials designed for use as printed circuit laminates.
AD450: RF & Microwave Laminate

AD450: RF & Microwave Laminate

Arlon’s AD450 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It can be specified to replace Arlon AR450, a composite with similar electrical properties, but based on non-woven fiberglass reinforcement.
AD350A: RF & Microwave Laminate

AD350A: RF & Microwave Laminate

Arlon’s Next Generation "AD350A" is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate.

High-Frequency Laminates and Circuits

The ComClad family of high-frequency laminates for semi-rigid or flexible circuits used in wireless communications is the first of its kind...
CLTE: RF & Microwave Laminate

CLTE: RF & Microwave Laminate

CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.
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