Laminates

PRODUCTS AND SERVICES

RF And Microwave Laminates

RF And Microwave Laminates

Arlon Materials for Electronics Division develops and manufactures copper clad RF & Microwave laminates and prepreg bonding materials for the fabrication of high performance and frequency dependent printed circuit boards. Arlon's Rf & Microwave Laminates are used in a variety of applications, including wireless communications infrastructure, military and commercial avionics, and semiconductor test and measurement equipment.
AD450: RF & Microwave Laminate

AD450: RF & Microwave Laminate

Arlon’s AD450 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It can be specified to replace Arlon AR450, a composite with similar electrical properties, but based on non-woven fiberglass reinforcement.

High-Frequency Laminates and Circuits

The ComClad family of high-frequency laminates for semi-rigid or flexible circuits used in wireless communications is the first of its kind...
Laminate For RF And Microwave Printed Circuit Boards: AD250C

Laminate For RF And Microwave Printed Circuit Boards: AD250C

Arlon’s AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
AD1000: High Dielectric Constant Laminate

AD1000: High Dielectric Constant Laminate

AD1000 is a high dielectric constant substrate that permits circuit miniaturization compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.
AD Series: RF And Microwave Laminates

AD Series: RF And Microwave Laminates

Arlon’s AD Series Laminates is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications
PIM Series: Passive Intermodulation Laminates

PIM Series: Passive Intermodulation Laminates

Arlon’s reduced Passive Intermodulation (PIM) laminates are a series of woven fiberglass reinforced Teflon (PTFE) composite materials designed for use as printed circuit laminates.
MultiClad: Low-Loss Multilayerable Laminate

MultiClad: Low-Loss Multilayerable Laminate

Arlon’s MultiClad HF is a new halogen-free low-loss system that represents the next generation in low-loss multilayerable thermoset laminate and prepreg systems for microwave and high-frequency printed circuit boards. This new multi-purpose PWB material technology combines a ceramic-filled low-loss, high reliability thermoset resin system with bromine-free flame retardant system to create a material that is unmatched in terms of environmental standards, electrical performance, mechanical stability, thermal reliability and cost.

More Products and Services
Newsletter Signup
Newsletter Signup
Get the latest RF/microwave industry news, insights, and analysis delivered to your inbox.
Join your peers
By clicking Sign Me Up, you agree to our Terms and that you have read our Privacy Policy.