Laminates

PRODUCTS AND SERVICES

CuClad: RF & Microwave Laminates

CuClad: RF & Microwave Laminates

CuClad® laminates are woven fiberglass/PTFE composite materials for use as printed circuit board substrates. Using precision control of the fiberglass/PTFE ratio, CuClad laminates offer a range of choices from the lowest dielectric constant and loss tangent to a more highly reinforced laminate with better dimensional stability
AD350A: RF & Microwave Laminate

AD350A: RF & Microwave Laminate

Arlon’s Next Generation "AD350A" is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate.

High-Frequency Laminates and Circuits

The ComClad family of high-frequency laminates for semi-rigid or flexible circuits used in wireless communications is the first of its kind...
AD450: RF & Microwave Laminate

AD450: RF & Microwave Laminate

Arlon’s AD450 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It can be specified to replace Arlon AR450, a composite with similar electrical properties, but based on non-woven fiberglass reinforcement.
Laminate For RF And Microwave Printed Circuit Boards: AD250C

Laminate For RF And Microwave Printed Circuit Boards: AD250C

Arlon’s AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
Laminate For RF And Microwave Printed Circuit Boards: AD255C

Laminate For RF And Microwave Printed Circuit Boards: AD255C

Arlon’s AD255C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD255C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
Laminate For RF And Microwave Printed Circuit Boards: AD300C

Laminate For RF And Microwave Printed Circuit Boards: AD300C

Arlon’s AD300C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. This ceramic-filled, woven fiberglass reinforced PTFE composite material is built on a cost-effective construction of unique chemistry formulation and processing to offer RF and Microwave designers an advantage for improving electrical and mechanical performances without the additional cost traditionally associated with higher performance. AD300C provides a significant improvement in cost/ performance over the existing AD300A product line and other traditional fluoropolymer-glass laminates.
MultiClad: Low-Loss Multilayerable Laminate

MultiClad: Low-Loss Multilayerable Laminate

Arlon’s MultiClad HF is a new halogen-free low-loss system that represents the next generation in low-loss multilayerable thermoset laminate and prepreg systems for microwave and high-frequency printed circuit boards. This new multi-purpose PWB material technology combines a ceramic-filled low-loss, high reliability thermoset resin system with bromine-free flame retardant system to create a material that is unmatched in terms of environmental standards, electrical performance, mechanical stability, thermal reliability and cost.

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