Laminates

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CLTE: RF & Microwave Laminate

CLTE: RF & Microwave Laminate

CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.
Laminate For RF And Microwave Printed Circuit Boards: AD250C

Laminate For RF And Microwave Printed Circuit Boards: AD250C

Arlon’s AD250C is the third generation, commercial microwave and RF laminate material designed with low dielectric, low cost and excellent low loss characteristics. AD250C is built on a cost-effective combination of composite chemistry and construction to yield an uncompromising level of price-performance for today’s telecommunication infrastructure.
AD350A: RF & Microwave Laminate

AD350A: RF & Microwave Laminate

Arlon’s Next Generation "AD350A" is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate.
RF And Microwave Laminates

RF And Microwave Laminates

Arlon Materials for Electronics Division develops and manufactures copper clad RF & Microwave laminates and prepreg bonding materials for the fabrication of high performance and frequency dependent printed circuit boards. Arlon's Rf & Microwave Laminates are used in a variety of applications, including wireless communications infrastructure, military and commercial avionics, and semiconductor test and measurement equipment.
AD Series: RF And Microwave Laminates

AD Series: RF And Microwave Laminates

Arlon’s AD Series Laminates is a group of woven fiberglass-reinforced PTFE composite materials designed for use as printed circuit board substrates. These materials combine the excellent low loss electrical properties of PTFE resin with the enhanced value of costeffective heavier fiberglass styles to provide low cost laminate materials suitable for high volume commercial wireless communication applications
PIM Series: Passive Intermodulation Laminates

PIM Series: Passive Intermodulation Laminates

Arlon’s reduced Passive Intermodulation (PIM) laminates are a series of woven fiberglass reinforced Teflon (PTFE) composite materials designed for use as printed circuit laminates.
AD1000: High Dielectric Constant Laminate

AD1000: High Dielectric Constant Laminate

AD1000 is a high dielectric constant substrate that permits circuit miniaturization compared to traditional low loss materials. It is especially beneficial for power amplifiers, filters, couplers and other components using low impedance lines.
AD300A: PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate

AD300A: PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate

AD300A is a woven fiberglass reinforced PTFE/Microfine Ceramic composite material and is a significant improvement in cost/performance over traditional fluoropolymer-glass laminates. This combination offers designers an advantage for improving electrical performance through the use of advanced material without the additional cost traditionally associated with higher performance...
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