TEST & MEASUREMENT APPLICATION NOTES AND WHITE PAPERS

• Combining On-Wafer VNA And Spectrum Analyzer Measurements

  This app note describes how S-parameters and spectrum analysis can be monitored simultaneously from 70 kHz to 110 GHz using the VectorStar ME7838A, the Spectrum Master MS2760A, and the Anritsu MN25110A W1 coaxial precision directional coupler.

• EMC32 To R&S ELEKTRA Migration Using The ELEKTRA Migration Tool

  Discover how to use the R&S ELEKTRA Migration Tool for converting the backup data into the XML format that can be interpreted by the R&S ELEKTRA software.

• Circuit Models For Plastic Packaged Microwave Diodes

  This paper reports on the measurement and establishment of circuit models for SOT-23 and SOD-323 packaged diodes. Results indicate that the 1.5 nH estimate for the SOT-23 is a useful result, as is 1.2 nH for SOD-323 single packaged diodes. It was also determined that the effective inductance of the SOT-23 may be reduced to approximately 0.4 nH by adding a second bond wire and modifying the microstrip line. Other lead configurations, including parallel bond wires and common cathode configurations, were also studied.

• Radiated Wireless Coexistence Testing

  This application notegives the reader a clear idea of how to configure standardized test instruments from R&S in order to generate the wanted signal as well as unintended interference signals and conduct measurement to monitor device performance.

• Electronic Packaging: Using EMI Material-Based Solutions

  It can be difficult when individual components could pass EMI testing but, as the components are combined into subsystems or into the final product, the DUT fails. Incorporating EMI shielding materials as part of an initial design is the most cost-effective way to prevent these last-minute issues during testing.