TEST & MEASUREMENT APPLICATION NOTES AND WHITE PAPERS

  • Top 5 Strategies For 5G Component Characterization And Test

    Component manufacturers need to deploy effective strategies for characterization and test regardless of the component types. This white paper presents five strategies for 5G component characterization and testing.

  • On-Wafer Characterization At sub-THz Frequencies

    New technologies and applications extend into sub-THz frequencies in the D band and beyond. New semiconductor technologies and processes need to be commercialized to support these efforts.

  • Battery Simulation With DC Power Supplies

    This application note guides users in creating custom battery models for R&S® NGM200 and R&S® NGU201 power supplies, enabling gradual battery discharge via QuickArb and data logging, with recorded data adaptable for battery simulation using a provided developer tool.

  • Small Cell Testing In FR2

    In the era of 5G, small cells have become pivotal in network densification. Explore the essential testing aspects of small cell devices throughout their product life cycle.

  • Load Transient Response – Enhancing Loop Stability Testing

    Ensuring stability in power supply design requires validating switching converter stability through frequency loop and load transient responses, aided by modern oscilloscopes for visualizing PWM signals and identifying converter effects.

TEST & MEASUREMENT SOLUTIONS

The GORE® PHASEFLEX® Series offers the smallest, lightest, internally ruggedized microwave/RF test assemblies for high density interconnection in RF and uW modular applications as well as in high speed digital testing. These assemblies feature ON cable construction and provide consistent, repeatable measurements with electrical performance up to 18, 26.5, 40, or 50 GHz.

Bird offers the FH-AV-KIT, a FlightHawk™ RF Aviation Test Kit designed for avionics testing and measurement applications. This kit includes a proven antenna and cable testing functionality of the FlightHawk handheld analyzer, all necessary adapters and cabling, and Bird’s aviation testing software that allows anyone on the maintenance team to test and verify all antenna systems in a fleet.

XF leverages the EM principle of superposition to quickly analyze port phase combinations with a single simulation.

The SMS7630 Series comprises low-cost, surface mountable, plastic packaged silicon mixer Schottky diodes designed for RF and microwave mixers and detectors. They include low barrier diodes and zero-bias detectors that combine Skyworks advanced semiconductor technology with low-cost packaging techniques. All diodes are 100 percent DC tested and deliver tight parameter distribution, which minimizes performance variability.

Radar simulation systems (i.e., RF sources and/or receivers) must perform to an exacting minimum standard if they are to accurately prove the field worthiness of EW systems.

Electrostatic discharge testing is utilized worldwide by electronics manufacturers to determine the ESD susceptibility of their devices. It is extremely difficult to estimate the exact cost of ESD loss annually, but it can safely be stated that ESD requires the development and testing of many hardware prototypes and contributes to a high number of warranty claims and loss of consumer confidence if failure occurs in the hands of the customer. Given the high cost in time and materials associated with ESD hardware testing, the ability to simulate the ESD testing process in XFdtd is extremely valuable, allowing engineers to pinpoint locations susceptible to ESD damage and optimize ESD mitigation during the concept and design stage of product development.

The Microwave VME/VXS Tuner by Hunter Technology is the industry’s smallest available microwave SIGINT VME tuner. It covers the 500 MHz-20.0 GHz and 30.0 GHz to 40.0 GHz frequency ranges and features incredibly fast tuning, low phase noise, excellent mechanical conductivity, a single slot 6U VME configuration, and much more.

Model HP 4268A is a capacitance meter designed for testing high value multilayer ceramic capacitor (MLCC) designs