Wind turbines located near a radar installation can significantly interfere with the ability of the radar to operate properly. Remcom has used our tools and expertise in radar scattering to perform a number of government-funded and internal research efforts into the impact that wind turbines and wind farms have on radar returns for Air Traffic Control (ATC) radar, early warning radar, weather radar, and instrumentation radar. We have also teamed with partners to investigate methods to mitigate this effect.
CST MPHYSICS STUDIO® (CST MPS) is seamlessly integrated into CST STUDIO SUITE®, enhancing the EM simulation tools by adding the ability to calculate thermal and mechanical stress effects. This easy-to-use tool allows a multiphysics approach for the complete simulation of devices.
SPEAG's latest release of SEMCAD X introduces a new solver based on the Mode Matching Technique for the accurate and fast simulation of passive waveguide structures. The new solver has been integrated into the existing SEMCAD X framework to solve complex EM challenges in microwave industry. Together with the EM and Thermal solvers, SEMCAD X Microwave can be successfully applied to a wide variety of electromagnetic problems ranging from microwave devices, EMC, optics, to bio-medical applications.
EM.CUBE™ utilizes a modular approach to the solution of large-scale electromagnetic problems. This powerful software suite features a number of computational modules built upon a common framework that work together seamlessly to provide practical solutions to system-level RF problems. Each computational module has been optimized to address a certain class of electromagnetic structures based on a particular numerical technique.
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•Product Brochure: EM.CUBE Modular 3-D Simulation And Design Environment
•EM.CUBE Demo Download And Installation Instructions
Sonnet’s high frequency electromagnetic (EM) software can be used in the analysis of microwave circuit discontinuities, arbitrary microstrip and stripline circuits, planar (patch) antennas, planar spiral inductors, RFIC and MMIC circuits, multi-layer circuits like LTCC and PCB technology, planar filter analysis, and high density interconnects.