RF Military Electronics Featured Articles
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For Better SWaP, Choose GaN
7/3/2013
Today’s GaN‐based products are rising to the challenge of rapidly evolving demands for size, reliability, linearity, power density and energy efficiency, by providing RF system engineers with the flexibility to achieve significantly higher power and efficiency, with lower part count, board space and resultant cost.
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Detection And Location Of Suspicious RF Traffic — A Geolocation Primer
7/3/2013
Today, more than ever before, monitoring RF spectrum activity in a given geographical area is becoming a necessity rather than a choice. Applications for examining the RF environment are almost boundless, and include regulatory enforcement, corporate security, defense, counter espionage and cyber security. By Malcolm Levy, Vice President, Americas, CRFS Inc., California
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Cognitive Tactical Communication Networks
6/11/2013
Cognitive Radio (CR ) has been an intensive topic of research in recent years. Its main applications range from the utilization of TV white spaces to interoperability between large communication systems in all layers.
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Advances In Radar Simulation And Design
5/6/2013
Advances in modern radar systems include specialized active antennas, microwave circuits and devices, agile beam steering and shape, and digital space-time signal processing. While the pace of radar technology continues to march forward, two fundamentals remain constant. The first is that the electromagnetic properties of antennas, radomes, and the installation platform are governed by the underlying and unwavering physics. By Lawrence Williams, PhD., Director Product Management, Matthew Commens, PhD., Product Manager, HFSS, and Steve Rousselle, Technical Director, ANSYS, Inc.
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A 13-kW S-Band GaN Power Amplifier Design For Radar Applications
5/2/2013
The introduction of GaN has enabled the manufacture of high-power, efficient amplifiers in a small volume. Explore the design and performance data for the VSS3607 amplifier, including results from a 1000-hour life test.
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White Paper: Airstrip™ — An Innovative Transmission Line Technology In Support Of Hi-Rel Space Qualified Packaging
9/28/2011
Mechanical integration of microwave components is often left as the last step while addressing manufacturing considerations for system-level designs. In many cases, the electrical design is analyzed, bread boards are built, electrical designs verified, and then it is left to the mechanical engineers to fit the various components into the final package. This paper shows how component manufacturers can help solve system-level packaging problems using Airstrip technology.
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White Paper: Advanced Microwave Laminate Materials For The Improvement Of Efficiency And Reliability In Antennas And Feed Networks
10/26/2010
Demands for higher system efficiency and improved product reliability at higher powers and wider operating temperature ranges in mission-critical antennas and feed networks have placed heightened and unique requirements on board materials. To meet these challenges, advanced laminate materials need to possess high electrical phase stability, dielectric constant control, high thermal conductivity, and multilayer capability. This article discusses the importance of critical material properties and explores new material developments for these applications. By George Q. Kang, Helena Li Hai, John C. Frankosky, Michael T. Smith, Arlon Materials for Electronics, Inc.
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Advanced Microwave Laminate Materials For The Improvement Of Efficiency And Reliability In Antennas And Feed Networks
10/26/2010
Demands for higher system efficiency and improved product reliability at higher powers and wider operating temperature ranges in mission-critical antennas and feed networks have placed heightened and unique requirements on board materials. To meet these challenges, advanced laminate materials need to possess high electrical phase stability, dielectric constant control, high thermal conductivity, and multilayer capability. This article discusses the importance of critical material properties and explores new material developments for these applications. By George Q. Kang, Helena Li Hai, John C. Frankosky, Michael T. Smith, Arlon Materials for Electronics, Inc.
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5 Mistakes To Avoid When Specifying Integrated Microwave Assemblies
10/6/2010
Thirty years ago, the original IMAs were known as MICs — microwave integrated circuits — that integrated several microwave components into a single housing. These products created multifunctional performance by combining individual circuits fabricated on alumina carriers in a precisely machined aluminum package. Today’s technology has greatly increased the complexity, density, and functionality of IMAs. The machined package has been replaced by multi-layer microwave circuit boards, and techniques have evolved for combining the surface-mount devices, MMICs (monolithic microwave integrated circuits), and alumina MIC substrates — all on a single surface. By Narda Microwave-East
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White Paper: 5 Mistakes To Avoid When Specifying Integrated Microwave Assemblies
10/6/2010
Thirty years ago, the original IMAs were known as MICs — microwave integrated circuits — that integrated several microwave components into a single housing. These products created multifunctional performance by combining individual circuits fabricated on alumina carriers in a precisely machined aluminum package.