PASSIVE COMPONENTS APPLICATION NOTES AND WHITE PAPERS
Power Handling Considerations for SMD Terminations, Attenuators, and Resistors
Power ratings for Anaren’s SMD Terminations, Attenuators, and Resistors are based off of the temperature at the solder interface where the solder is in contact with the SMD components. This application note describes the power rating of high power surface mount resistive products, as well as techniques for maximizing power handling performance of these products.
Thermal Power Testing Methodology for Chip, Flange, and PCB-Mounted Resistors
Resistors can be used to dissipate excess power, act as a system’s safety mechanism, provide a matching device, and more. Resistors convert electrical energy into heat energy through the use of a resistive element. They’re usually mounted to a heatsink, a flange, or directly on a PCB.
Recommended Soldering Techniques for SMD, Chip, Flangeless, and Flanged Resistors
This application note provides recommendations for attached Anaren’s SMD, chip, flangeless, and flanged resistive products. A good solder joint can be critical in achieving a chip’s maximum performance. Mounting considerations for each different type are included with accompanying figures for visual aids. All Anaren resistives have a matte tin outside finish to achieve good solderability and RoHS compliance.
A Novel RF Coupler For SMART Utility Meter Remote Antenna Applications
In response to climate change nations across the globe have recognized the need for reducing their carbon emissions, and energy consumption. By Norman Smith, Gopinath Gampala & CJ Reddy