• The Thick Film Division, ISO 9001:2000 Registered, manufactures thick film chip resistors and jumpers that are also qualified to “S” Life Failure Rate and “T” Space Level complete to MI-PRF-55342 and MIL-PRF-32159 testing compliances. Also, a manufacturer of wire and ribbon bondable and flipchip thick film chip attenuators, which provide attenuation accuracy for frequencies to 10 Ghz.

• The Thin Film Division, ISO 9001:2000 Registered, is a manufacturer of thin film chip resistors with low TCR’s starting at ±2ppm/°C, tight tolerances as low as 0.01%, resistor arrays, chip attenuators, MOS style capacitors, and RC networks for microcircuit designs that demand high stability, low noise and optimal miniaturization. With sizes starting at 0.012” x 0.009”, we can meet all critical size applications. For Microwave/RF applications, these components have an operating frequency range of DC through 20 Ghz.

• The Electronic Package Division produces the “Ultimate” protection devices, offering a wide range of microelectronic package solutions. Many sizes and configurations are available for virtually any application. MSI has the ability to ground the sealing rim of our Alumina/Glass sidewall flatpacks to the package base plane for enhanced electrical performance.

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•Product Catalog: Thin Film Division
•Product Catalog: Thick Film Division
•Product Catalog: Electronic Package Division