Arlon Microwave Materials specializes in products made from fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, ceramic-filled hydrocarbon thermosets, and other materials that deliver the electrical performance needed in frequency-dependent circuit applications. These products are supplied as copper-clad laminates with bonding plies, or prepregs, for production of multilayer printed circuits. Arlon has over "50 years of experience in microwave materials", today providing products that are used to make combiner boards and feed networks for microwave applications as well as basestation antennas and power amplifier boards for the wireless telecommunications infrastructure market.
Our facilities in California and Delaware employ state-of-the-art production equipment, engineered to provide cost-effective, flexible manufacturing capacity to permit quick response to customer requirements while meeting the most stringent quality and tolerance demands. Both of our manufacturing sites are ISO 9001: 2000 registered, and through rigorous quality control practices and commitment to continual improvement, we are dedicated to meeting and exceeding our customer’s requirements.
Arlon is very dedicated to supporting our Global customers. In early 2004, Arlon opened a Finishing Center in Suzhou, Jiangsu Province, China. This successful launch led to the investment in a Highly Flexible Manufacturing Facility that opened in October 2006, also in Suzhou. This facility contains a new, State-of-the-Art Vacuum Press that has the capability to laminate both High Temperature PTFE Microwave Laminates as well as Lower Temperature Epoxy and Resin Electronic Substrates.
Arlon maintains a significant commitment to research & development. In the past few years, we have introduced several product innovations for high performance, cost-effective circuit board applications, including 55ST & 65GT - respectively, high peel strength and halogen-free flame retardant non-woven aramid laminate and prepreg systems, and the first high Dk,10.2, super-thin, 0.0024", ceramic-filled PTFE substrate on woven glass - AD10. In addition, Arlon has recently introduced FoamClad R/F 100, a new patented laminate construction using foam as the dielectric that offers a cost effective solution for high performance antennas. This was followed with the launch of our mechanically robust AD1000, with a 10.2 Dk. The AD1000 has a "Best-in-Class" loss tangent, lowest CTE and moisture absorption values in its class and highest Thermal Conductivity available. You can expect to see additional product innovations from our development pipeline in the months and years to come.
Arlon's Microwave University Program
Click here to download Arlon’s Microwave And RF Materials Guide.
Microwave
Products
|
Product |
Dielectric
Constant |
Dissipation
Factor |
Type
IPC-4103 |
Processing
Guidelines |
|
Traditional
Products - High PTFE to Glass Ratio, Lowest Loss
|
|
|
Woven
Fiberglass Reinforced PTFE - Unidirectional Plies
|
|
|
DiClad
522
|
2.40
- 2.60 ± 0.05
|
0.001
|
GT
/01
|
DiClad
Series Processing Guidelines
|
|
DiClad
527
|
2.40
- 2.60 ± 0.04
|
0.0018
|
GX
/02
|
|
DiClad
870
|
2.33
± 0.02
|
0.0013
|
GY
/05
|
|
DiClad
880
|
2.17,
2.20 ± 0.02
|
0.0009
|
GY
/05
|
|
|
|
|
|
*
Mil-S-13949 inactivated
|
|
Traditional
Products - High PTFE to Glass Ratio, Lowest Loss
|
|
|
Woven
Fiberglass Reinforced PTFE - Crossplied
|
|
|
|
CuClad
250GT
|
2.40
- 2.60 ± 0.05
|
0.001
|
GT
/01
|
CuClad
Series Processing Guidelines
|
|
CuClad
250GX
|
2.40
- 2.60 ± 0.04
|
0.0018
|
GX
/02
|
|
CuClad
233LX
|
2.33
± 0.02
|
0.0013
|
GY
/05
|
|
CuClad
217LX
|
2.17,
2.20 ± 0.02
|
0.0009
|
GY
/05
|
|
|
|
|
|
*
Mil-S-13949 inactivated
|
|
Traditional
Products - High PTFE to Glass Ratio, Lowest Loss
|
|
|
Non-Woven
Reinforced PTFE
|
|
|
|
|
IsoClad
917
|
2.17
± 0.04
|
0.0013
|
GP,
GR /03, 04
|
IsoClad
Series Processing Guidelines
|
|
IsoClad
933
|
2.33
± 0.04
|
0.0016
|
GP,
GR /03, 04
|
|
|
|
|
|
*
Mil-S-13949 inactivated
|
|
Highest
Dk Stability vs. Temperature - Critical for
Phase Sensitive Applications
|
|
High
Performance Laminates for Avionics, Radars, CNI and Phase Sensitive
Filters
|
|
Reinforced
PTFE with microdispersed Ceramic
|
|
|
|
CLTE-XT
|
2.94
± 0.03
|
0.0012
|
/06
|
CLTE,CLTE-LC
& CLTE-P Processing
|
|
CLTE
|
2.96
|
0.0023
|
/06
|
|
CLTE-LC
|
2.94
|
0.0025
|
/06
|
|
|
|
|
|
|
|
High
Thermal Conductivity, Temperature Phase Stable, Low CTE Laminates. Excellent for Heat Dissipation, reduces
Junction Temperatures, improves device and solder joint reliability. Excellent
for Power Amplifiers and Antennas Sensitive to Dielectric Constant
changes with Temperature |
|
TC350 (beta) |
3.50 ±
0.05 |
0.0025 |
/09 /16 |
TC Series Processing
Guidelines |
|
TC600 |
6.15 ±
0.15 |
0.0020 |
/07 |
|
|
|
|
|
|
|
Next
Generation of Lower Loss Materials, Available with PIM+ Technology; Not Available below
0.020". |
|
Typical
thicknesses include 0.030", 0.031", 0.040", 0.060", and 0.062". Inquire for thicker
laminates. |
|
AD255A |
2.55 |
0.0015 |
N/A |
AD
Series Processing Guidelines
|
|
AD260A
|
2.60 |
0.0017 |
N/A |
|
AD300A
|
3.00 |
0.0020 |
/09 |
|
AD320A |
3.20 |
0.0032 |
/09 |
|
|
|
|
|
|
|
PTFE and
Microdispersed Ceramic reinforced with Commercial
Grade Glass |
|
AD350A
|
3.50± 0.05 |
0.003 |
/09, /16 |
AD
Series Processing Guidelines
|
|
AD410
|
4.10 |
0.003 |
/16 |
|
AD430
|
4.30 |
0.003 |
/16 |
|
AD450
|
4.50 |
0.0035 |
/16 |
|
AD1000
|
10.2 |
0.0023 |
/08 |
AD1000
Processing Guidelines
|
|
|
|
|
|
|
|
Ultra
Thin Laminates with Higher Dielectric Constant |
|
|
AD5
|
5.1 |
0.003 |
/16 |
AD
Series Processing Guidelines
|
|
AD10
|
10.2 |
0.005 |
N/A |
|
|
|
|
|
|
|
Ceramic
Hydrocarbon Thermoset Laminates and Pre-Pregs |
|
25N
|
3.38 ±
0.06 |
0.0025 |
/10 |
25N/FR
Processing Guidelines
|
|
25FR
|
3.58 ±
0.06 |
0.0035 |
/11 |
|
|
|
|
|
|
|
Reduced
Passive Intermodulation (PIM)
Laminates |
|
DiClad
880-PIM
|
2.17, 2.20 ±
0.02 |
0.0009 |
GY /05 |
PIM
Series Data Sheet
|
|
AD
Series PIM
|
2.50 -
3.50 |
0.002
-0.003 |
/09 |
|
AD "A" Series PIM+
Technology available from 2.55 to 3.20 (see above) |
|
|
|
|
|
|
| |
