RF Globalnet provides detailed coverage of the design and development of RF/microwave subsystems and components such as amplifiers, oscillators, modulators, attenuators, mixers, resonators, frequency synthesizers, filters, coaxial cables, connectors, switches, antennas, RFICs, chip sets, transmitters, receivers, and transceivers.  The site also includes information on discrete components such as diodes, inductors, capacitors, transistors, and resistors.  We also examine the technology that creates and verifies the design, namely test and measurement equipment, computer-aided-design (CAD) tools and electronic-design-automation (EDA) tools, among others
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Arlon Microwave Materials specializes in products made from fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, ceramic-filled hydrocarbon thermosets, and other materials that deliver the electrical performance needed in frequency-dependent circuit applications. These products are supplied as copper-clad laminates with bonding plies, or prepregs, for production of multilayer printed circuits. Arlon has over "50 years of experience in microwave materials", today providing products that are used to make combiner boards and feed networks for microwave applications as well as basestation antennas and power amplifier boards for the wireless telecommunications infrastructure market.

Our facilities in California and Delaware employ state-of-the-art production equipment, engineered to provide cost-effective, flexible manufacturing capacity to permit quick response to customer requirements while meeting the most stringent quality and tolerance demands. Both of our manufacturing sites are ISO 9001: 2000 registered, and through rigorous quality control practices and commitment to continual improvement, we are dedicated to meeting and exceeding our customer’s requirements.


Arlon is very dedicated to supporting our Global customers. In early 2004, Arlon opened a Finishing Center in Suzhou, Jiangsu Province, China. This successful launch led to the investment in a Highly Flexible Manufacturing Facility that opened in October 2006, also in Suzhou. This facility contains a new, State-of-the-Art Vacuum Press that has the capability to laminate both High Temperature PTFE Microwave Laminates as well as Lower Temperature Epoxy and Resin Electronic Substrates.

Arlon maintains a significant commitment to research & development. In the past few years, we have introduced several product innovations for high performance, cost-effective circuit board applications, including 55ST & 65GT - respectively, high peel strength and halogen-free flame retardant non-woven aramid laminate and prepreg systems, and the first high Dk,10.2, super-thin, 0.0024", ceramic-filled PTFE substrate on woven glass - AD10. In addition, Arlon has recently introduced FoamClad R/F 100, a new patented laminate construction using foam as the dielectric that offers a cost effective solution for high performance antennas. This was followed with the launch of our mechanically robust AD1000, with a 10.2 Dk. The AD1000 has a "Best-in-Class" loss tangent, lowest CTE and moisture absorption values in its class and highest Thermal Conductivity available. You can expect to see additional product innovations from our development pipeline in the months and years to come.

Arlon's Microwave University Program

Click here to download Arlon’s Microwave And RF Materials Guide.

Microwave Products

Product

Dielectric Constant

Dissipation Factor

Type IPC-4103

Processing Guidelines

CLTE PRODUCT FAMILY (Highest degree of Performance)

CLTE-XT

2.94 ± 0.03

0.0012

/06

CLTE,CLTE-LC & CLTE-P Processing

CLTE-AT

3.00 ± 0.04

0.0013

/06

CLTE

2.96

0.0023

/06

Highest Dk Stability vs. Temperature - Critical for Phase Sensitive Applications

High Performance Laminates for Avionics, Radars, CNI and Phase Sensitive Filters

Reinforced PTFE with microdispersed Ceramic

 

 

 

 

 

TC PRODUCT FAMILY (Thermally Conductive, Temperature Phase Stable)

TC350

3.50 ± 0.05

0.0020

/09 /16

TC Series Processing Guidelines

TC600

6.15 ± 0.15

0.0020

/07

High Thermal Conductivity, Temperature Phase Stable, Low CTE Laminates.  Excellent for Heat Dissipation, reduces Junction Temperatures, improves device and solder joint reliability.  Excellent  for Power Amplifiers and Antennas Sensitive to Dielectric Constant changes with Temperature

 

 

 

 

 

Next Generation of Lower Loss Materials, Available with PIM+ Technology

AD255A

2.55 ± 0.04

0.0015

N/A

AD Series Processing Guidelines

AD260A

2.60 ± 0.04

0.0017

N/A

AD300A

3.00 ± 0.04

0.002

/09

AD320A

3.20 ± 0.04

0.0032

/09

Scroll down for Original AD Series Products.   "AD "A" Series" Products are not Available below 0.020"

Typical thicknesses include 0.030", 0.031", 0.040", 0.060", and 0.062".  Inquire for thicker laminates

 

 

 

 

 

PTFE and Microdispersed Ceramic reinforced with Commercial Grade Glass

AD350A

3.50± 0.05

0.003

/09, /16

AD Series Processing Guidelines

AD410

4.10

0.003

/16

AD430

4.30

0.003

/16

AD450

4.50

0.0035

/16

AD1000

10.2

0.0023

/08

AD1000 Processing Guidelines

 

 

 

 

 

Traditional Products  - High PTFE to Glass Ratio, Lowest Loss

  

Woven Fiberglass Reinforced PTFE - Unidirectional Plies

  

DiClad 522

2.40 - 2.60 ± 0.05 

0.001

GT  /01

 DiClad Series Processing Guidelines

DiClad 527

2.40 - 2.60  ± 0.04

0.0018

GX  /02

DiClad 870

2.33 ± 0.02

0.0013

GY  /05

DiClad 880

2.17, 2.20 ± 0.02

0.0009

GY  /05

 

 

 

 

* Mil-S-13949 inactivated

Traditional Products  - High PTFE to Glass Ratio, Lowest Loss

  

Woven Fiberglass Reinforced PTFE - Crossplied

 

  

CuClad 250GT

2.40 - 2.60 ± 0.05 

0.001

GT  /01

CuClad Series Processing Guidelines

CuClad 250GX

2.40 - 2.60  ± 0.04

0.0018

GX  /02

CuClad 233LX

2.33 ± 0.02

0.0013

GY  /05

CuClad 217LX

2.17, 2.20 ± 0.02

0.0009

GY  /05

 

 

 

 

* Mil-S-13949 inactivated

Traditional Products - High PTFE to Glass Ratio, Lowest Loss

  

Non-Woven  Reinforced PTFE

 

 

  

IsoClad 917

2.17 ± 0.04

0.0013

GP, GR /03, 04

IsoClad Series Processing Guidelines

IsoClad 933

2.33 ± 0.04

0.0016

GP, GR /03, 04

 

 

 

 

* Mil-S-13949 inactivated

Ultra Thin Laminates with Higher Dielectric Constant

  

AD5

5.1

0.003

/16

AD Series Processing Guidelines

AD10

10.2

0.005

N/A

 

 

 

 

 

Ceramic Hydrocarbon Thermoset Laminates and Pre-Pregs

25N

3.38 ± 0.06

0.0025

/10

25N/FR Processing Guidelines

25FR

3.58 ± 0.06

0.0035

/11

 

 

 

 

 

Reduced Passive Intermodulation (PIM) Laminates

DiClad 880-PIM

2.17, 2.20 ± 0.02

0.0009

GY  /05

PIM Series Data Sheet

AD Series PIM

2.50 - 3.50

0.002 -0.003

/09

AD "A" Series PIM+ Technology available from 2.55 to 3.20 (see above)

 

 

 

 

 

Legacy, Low Cost Commercial Based Laminates

Next Generation Alternatives may be available (see above offerings or inquire for details)

AD250

2.50

0.0017

/02

AD Series Processing Guidelines

AD255

2.55

0.0018

/02

AD270

2.70

0.0023

/09

AD320

3.20

0.0038

/09

AD350

3.50

0.003

/09

AD600

6.15

0.003

/07

AD600 Processing Guidelines

AR1000

9.8

0.003

/08

AR1000 Processing Guidelines

 

 

 

 

 

Thermoplastic Bonding Films for Stripline and Multilayer Packages

CuClad 6250

2.32 ± 0.10

0.0013

/15

CuClad 6250/6700 Data/Processing

CuClad 6700

2.35 ± 0.10

0.0025

/15

CLTE-P

2.94

0.0025

/06

CLTE,CLTE-LC & CLTE-P Processing



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Contact Information     
Arlon Materials for Electronics
9433 Hyssop Drive
Rancho Cucamonga, California 91730
UNITED STATES
Phone: (866) 394-6508
Contact: Customer Service

Hot Products     
arlonpackpic
RF And Microwave Laminates
CLTE-AT: Commercial Ceramic PTFE Composite
CLTE: RF & Microwave Laminate
CLTE-LC: RF & Microwave Laminate
CLTE-XT: Micro-Dispersed Ceramic PTFE Composite
CuClad: RF & Microwave Laminates
DiClad: Woven Fiberglass/PTFE Composite Materials
IsoClad: RF & Microwave Laminates
AD Series: RF And Microwave Laminates
AD10: High Dielectric Constant Laminate
AD1000: High Dielectric Constant Laminate
AD300A: PTFE/Woven Fiberglass/Micro-Ceramic Filled Laminate
AD350A: RF & Microwave Laminate
AD450: RF & Microwave Laminate
25N/FR: Ceramic-Filled Composite Materials
TC600: 6.15 Dielectric Constant Material
PIM Series: Passive Intermodulation Laminates

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