Arlon Microwave Materials specializes in products made from fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, ceramic-filled hydrocarbon thermosets, and other materials that deliver the electrical performance needed in frequency-dependent circuit applications. These products are supplied as copper-clad laminates with bonding plies, or prepregs, for production of multilayer printed circuits. Arlon has over "50 years of experience in microwave materials", today providing products that are used to make combiner boards and feed networks for microwave applications as well as basestation antennas and power amplifier boards for the wireless telecommunications infrastructure market.

Our facilities in California and Delaware employ state-of-the-art production equipment, engineered to provide cost-effective, flexible manufacturing capacity to permit quick response to customer requirements while meeting the most stringent quality and tolerance demands. Both of our manufacturing sites are ISO 9001: 2000 registered, and through rigorous quality control practices and commitment to continual improvement, we are dedicated to meeting and exceeding our customer’s requirements.

Arlon is very dedicated to supporting our Global customers. In early 2004, Arlon opened a Finishing Center in Suzhou, Jiangsu Province, China. This successful launch led to the investment in a Highly Flexible Manufacturing Facility that opened in October 2006, also in Suzhou. This facility contains a new, State-of-the-Art Vacuum Press that has the capability to laminate both High Temperature PTFE Microwave Laminates as well as Lower Temperature Epoxy and Resin Electronic Substrates.

Arlon maintains a significant commitment to research & development. In the past few years, we have introduced several product innovations for high performance, cost-effective circuit board applications, including 55ST & 65GT - respectively, high peel strength and halogen-free flame retardant non-woven aramid laminate and prepreg systems, and the first high Dk,10.2, super-thin, 0.0024", ceramic-filled PTFE substrate on woven glass - AD10. In addition, Arlon has recently introduced FoamClad R/F 100, a new patented laminate construction using foam as the dielectric that offers a cost effective solution for high performance antennas. This was followed with the launch of our mechanically robust AD1000, with a 10.2 Dk. The AD1000 has a "Best-in-Class" loss tangent, lowest CTE and moisture absorption values in its class and highest Thermal Conductivity available. You can expect to see additional product innovations from our development pipeline in the months and years to come.

Arlon's Microwave University Program

Click here to download Arlon’s Microwave And RF Materials Guide.

Microwave Products

Product Dielectric Constant Dissipation Factor Type IPC-4103 Processing Guidelines CLTE PRODUCT FAMILY (Highest degree of Performance) CLTE-XT 2.94 ± 0.03 0.0012 /06 CLTE,CLTE-LC & CLTE-P Processing CLTE-AT 3.00 ± 0.04 0.0013 /06 CLTE 2.96 0.0023 /06 Highest Dk Stability vs. Temperature - Critical for Phase Sensitive Applications High Performance Laminates for Avionics, Radars, CNI and Phase Sensitive Filters Reinforced PTFE with microdispersed Ceramic           TC PRODUCT FAMILY (Thermally Conductive, Temperature Phase Stable) TC350 3.50 ± 0.05 0.0020 /09 /16 TC Series Processing Guidelines TC600 6.15 ± 0.15 0.0020 /07 High Thermal Conductivity, Temperature Phase Stable, Low CTE Laminates.  Excellent for Heat Dissipation, reduces Junction Temperatures, improves device and solder joint reliability.  Excellent  for Power Amplifiers and Antennas Sensitive to Dielectric Constant changes with Temperature           Next Generation of Lower Loss Materials, Available with PIM+ Technology AD255A 2.55 ± 0.04 0.0015 N/A AD Series Processing Guidelines AD260A 2.60 ± 0.04 0.0017 N/A AD300A 3.00 ± 0.04 0.002 /09 AD320A 3.20 ± 0.04 0.0032 /09 Scroll down for Original AD Series Products.   "AD "A" Series" Products are not Available below 0.020" Typical thicknesses include 0.030", 0.031", 0.040", 0.060", and 0.062".  Inquire for thicker laminates           PTFE and Microdispersed Ceramic reinforced with Commercial Grade Glass AD350A 3.50± 0.05 0.003 /09, /16 AD Series Processing Guidelines AD410 4.10 0.003 /16 AD430 4.30 0.003 /16 AD450 4.50 0.0035 /16 AD1000 10.2 0.0023 /08 AD1000 Processing Guidelines           Traditional Products  - High PTFE to Glass Ratio, Lowest Loss    Woven Fiberglass Reinforced PTFE - Unidirectional Plies    DiClad 522 2.40 - 2.60 ± 0.05  0.001 GT  /01  DiClad Series Processing Guidelines DiClad 527 2.40 - 2.60  ± 0.04 0.0018 GX  /02 DiClad 870 2.33 ± 0.02 0.0013 GY  /05 DiClad 880 2.17, 2.20 ± 0.02 0.0009 GY  /05         * Mil-S-13949 inactivated Traditional Products  - High PTFE to Glass Ratio, Lowest Loss    Woven Fiberglass Reinforced PTFE - Crossplied      CuClad 250GT 2.40 - 2.60 ± 0.05  0.001 GT  /01 CuClad Series Processing Guidelines CuClad 250GX 2.40 - 2.60  ± 0.04 0.0018 GX  /02 CuClad 233LX 2.33 ± 0.02 0.0013 GY  /05 CuClad 217LX 2.17, 2.20 ± 0.02 0.0009 GY  /05         * Mil-S-13949 inactivated Traditional Products - High PTFE to Glass Ratio, Lowest Loss    Non-Woven  Reinforced PTFE        IsoClad 917 2.17 ± 0.04 0.0013 GP, GR /03, 04 IsoClad Series Processing Guidelines IsoClad 933 2.33 ± 0.04 0.0016 GP, GR /03, 04         * Mil-S-13949 inactivated Ultra Thin Laminates with Higher Dielectric Constant    AD5 5.1 0.003 /16 AD Series Processing Guidelines AD10 10.2 0.005 N/A           Ceramic Hydrocarbon Thermoset Laminates and Pre-Pregs 25N 3.38 ± 0.06 0.0025 /10 25N/FR Processing Guidelines 25FR 3.58 ± 0.06 0.0035 /11           Reduced Passive Intermodulation (PIM) Laminates DiClad 880-PIM 2.17, 2.20 ± 0.02 0.0009 GY  /05 PIM Series Data Sheet AD Series PIM 2.50 - 3.50 0.002 -0.003 /09 AD "A" Series PIM+ Technology available from 2.55 to 3.20 (see above)           Legacy, Low Cost Commercial Based Laminates Next Generation Alternatives may be available (see above offerings or inquire for details) AD250 2.50 0.0017 /02 AD Series Processing Guidelines AD255 2.55 0.0018 /02 AD270 2.70 0.0023 /09 AD320 3.20 0.0038 /09 AD350 3.50 0.003 /09 AD600 6.15 0.003 /07 AD600 Processing Guidelines AR1000 9.8 0.003 /08 AR1000 Processing Guidelines           Thermoplastic Bonding Films for Stripline and Multilayer Packages CuClad 6250 2.32 ± 0.10 0.0013 /15 CuClad 6250/6700 Data/Processing CuClad 6700 2.35 ± 0.10 0.0025 /15 CLTE-P 2.94 0.0025 /06 CLTE,CLTE-LC & CLTE-P Processing