Arlon Materials for Electronics - Copper Clad Laminates and Prepreg Bonding Materials

About Us

Arlon Microwave Materials specializes in products made from fluoropolymers (i.e. PTFE), ceramic-filled fluoropolymers, ceramic-filled hydrocarbon thermosets, and other materials that deliver the electrical performance needed in frequency-dependent circuit applications. These products are supplied as copper-clad laminates with bonding plies, or prepregs, for production of multilayer printed circuits. Arlon has over "50 years of experience in microwave materials", today providing products that are used to make combiner boards and feed networks for microwave applications as well as basestation antennas and power amplifier boards for the wireless telecommunications infrastructure market.

Our facilities in California and Delaware employ state-of-the-art production equipment, engineered to provide cost-effective, flexible manufacturing capacity to permit quick response to customer requirements while meeting the most stringent quality and tolerance demands. Both of our manufacturing sites are ISO 9001: 2000 registered, and through rigorous quality control practices and commitment to continual improvement, we are dedicated to meeting and exceeding our customer's requirements.

Arlon is very dedicated to supporting our Global customers. In early 2004, Arlon opened a Finishing Center in Suzhou, Jiangsu Province, China. This successful launch led to the investment in a Highly Flexible Manufacturing Facility that opened in October 2006, also in Suzhou. This facility contains a new, State-of-the-Art Vacuum Press that has the capability to laminate both High Temperature PTFE Microwave Laminates as well as Lower Temperature Epoxy and Resin Electronic Substrates.

Arlon maintains a significant commitment to research & development. In the past few years, we have introduced several product innovations for high performance, cost-effective circuit board applications, including 55ST & 65GT - respectively, high peel strength and halogen-free flame retardant non-woven aramid laminate and prepreg systems, and the first high Dk,10.2, super-thin, 0.0024", ceramic-filled PTFE substrate on woven glass - AD10. In addition, Arlon has recently introduced FoamClad R/F 100, a new patented laminate construction using foam as the dielectric that offers a cost effective solution for high performance antennas. This was followed with the launch of our mechanically robust AD1000, with a 10.2 Dk. The AD1000 has a "Best-in-Class" loss tangent, lowest CTE and moisture absorption values in its class and highest Thermal Conductivity available. You can expect to see additional product innovations from our development pipeline in the months and years to come.

Arlon's Microwave University Program

Click here to download Arlon's Microwave And RF Materials Guide.

Microwave Products

Product	Dielectric Constant		Dissipation Factor	Type IPC-4103	Processing Guidelines
CLTE PRODUCT FAMILY (Highest degree of Performance)
CLTE-XT		2.94 ± 0.03	0.0012	/06	CLTE,CLTE-LC & CLTE-P Processing
CLTE-AT		3.00 ± 0.04	0.0013	/06
CLTE		2.96	0.0023	/06
Highest Dk Stability vs. Temperature - Critical for Phase Sensitive Applications High Performance Laminates for Avionics, Radars, CNI and Phase Sensitive Filters Reinforced PTFE with microdispersed Ceramic

TC PRODUCT FAMILY (Thermally Conductive, Temperature Phase Stable)
TC350	3.50 ± 0.05		0.0020	/09 /16	TC Series Processing Guidelines
TC600	6.15 ± 0.15		0.0020	/07
High Thermal Conductivity, Temperature Phase Stable, Low CTE Laminates. Excellent for Heat Dissipation, reduces Junction Temperatures, improves device and solder joint reliability. Excellent for Power Amplifiers and Antennas Sensitive to Dielectric Constant changes with Temperature

Next Generation of Lower Loss Materials, Available with PIM+ Technology
AD255A	2.55 ± 0.04		0.0015	N/A	AD Series Processing Guidelines
AD260A	2.60 ± 0.04		0.0017	N/A
AD300A	3.00 ± 0.04		0.002	/09
AD320A	3.20 ± 0.04		0.0032	/09
AD250C	2.50 ± 0.04		0.0011 - 0.0014	N/A
AD255C	2.55 ± 0.04		0.0011 - 0.0014	N/A
AD300C	2.97 ± 0.04		0.0014 - 0.0020	N/A
Scroll down for Original AD Series Products. "AD "A" Series" Products are not Available below 0.020" Typical thicknesses include 0.030", 0.031", 0.040", 0.060", and 0.062". Inquire for thicker laminates

PTFE and Microdispersed Ceramic reinforced with Commercial Grade Glass
AD350A	3.50± 0.05		0.003	/09, /16	AD Series Processing Guidelines
AD410	4.10		0.003	/16
AD430	4.30		0.003	/16
AD450	4.50		0.0035	/16
AD1000	10.2		0.0023	/08	AD1000 Processing Guidelines

Traditional Products - High PTFE to Glass Ratio, Lowest Loss
Woven Fiberglass Reinforced PTFE - Unidirectional Plies
DiClad 522	2.40 - 2.60 ± 0.05		0.001	GT /01	DiClad Series Processing Guidelines
DiClad 527	2.40 - 2.60 ± 0.04		0.0018	GX /02
DiClad 870	2.33 ± 0.02		0.0013	GY /05
DiClad 880	2.17, 2.20 ± 0.02		0.0009	GY /05
					* Mil-S-13949 inactivated
Traditional Products - High PTFE to Glass Ratio, Lowest Loss
Woven Fiberglass Reinforced PTFE - Crossplied
CuClad 250GT	2.40 - 2.60 ± 0.05		0.001	GT /01	CuClad Series Processing Guidelines
CuClad 250GX	2.40 - 2.60 ± 0.04		0.0018	GX /02
CuClad 233LX	2.33 ± 0.02		0.0013	GY /05
CuClad 217LX	2.17, 2.20 ± 0.02		0.0009	GY /05
					* Mil-S-13949 inactivated
Traditional Products - High PTFE to Glass Ratio, Lowest Loss
Non-Woven Reinforced PTFE
IsoClad 917	2.17 ± 0.04		0.0013	GP, GR /03, 04	IsoClad Series Processing Guidelines
IsoClad 933	2.33 ± 0.04		0.0016	GP, GR /03, 04
					* Mil-S-13949 inactivated

Ceramic Hydrocarbon Thermoset Laminates and Pre-Pregs
25N	3.38 ± 0.06		0.0025	/10	25N/FR Processing Guidelines
25FR	3.58 ± 0.06		0.0035	/11

Reduced Passive Intermodulation (PIM) Laminates
DiClad 880-PIM	2.17, 2.20 ± 0.02		0.0009	GY /05	PIM Series Data Sheet
AD Series PIM	2.50 - 3.50		0.002 -0.003	/09
AD "A" Series PIM+ Technology available from 2.55 to 3.20 (see above)

Legacy, Low Cost Commercial Based Laminates
Next Generation Alternatives may be available (see above offerings or inquire for details)
AD250	2.50		0.0017	/02	AD Series Processing Guidelines
AD255	2.55		0.0018	/02
AD270	2.70		0.0023	/09
AD320	3.20		0.0038	/09
AD350	3.50		0.003	/09
AD600	6.15		0.003	/07	AD600 Processing Guidelines
AR1000	9.8		0.003	/08	AR1000 Processing Guidelines

Thermoplastic Bonding Films for Stripline and Multilayer Packages
CuClad 6250	2.32 ± 0.10		0.0013	/15	CuClad 6250/6700 Data/Processing
CuClad 6700	2.35 ± 0.10		0.0025	/15
CLTE-P	2.94		0.0025	/06	CLTE,CLTE-LC & CLTE-P Processing

Contact Information

Arlon Materials for Electronics

1100 Governor Lea Road

Bear, DE 19701

UNITED STATES

Phone: 302-834-2100

Fax: 909-987-8541

Contact: Customer Service

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