News | June 7, 2007

MTT-S 2007: Tyco Electronics Expands M/A-COM RFID Reader Module Line

Source: Cobham

Honolulu -- IEEE MTT-S International Microwave Symposium -- Tyco Electronics announced the expansion of the M/A-COM RFID reader module line to include new I/Q (In-Phase/Quadrature), source and transmit modules. The new M/A-COM RFID reader modules are ideal for a variety of applications, specifically those that require high performance, flexible and compact features.

The MAIA-007860-000100, MAIA-007859-000100 and the MAIA-007775-000100 I/Q modules are designed to cover the worldwide 850 MHz – 960 MHz frequency range with a phase balance of <2.5 deg and a noise floor of ~160dBm/Hz. The MAIA-007860-000100 (low local oscillator drive) has a range of -4 to 2 dBm LO drive, an excellent carrier suppression of ~44 dBc and a sideband suppression of ~36 dBc. The MAIA-007859-000100 (medium LO drive) has a range of 0 to 6 dBm LO drive, a carrier suppression of ~ 44 dBc and a sideband suppression of ~ 42 dBc, and the MAIA-007775-000100 (high LO drive) has a range of 2 to 8 dBm LO drive, a carrier suppression of ~36 dBc and a sideband suppression of ~37 dBc.

The MAIA-007028-000100 source module utilizes an integrated VCO (voltage-controlled oscillator), phased-locked loop filter and has a TCXO (temperature-compensated crystal oscillator) with <10 ppm stability and low phase noise. The source modules are specifically targeted for the RFID market and cover the worldwide frequency bands.

The MAIA-007851-000100 transmit module is specifically targeted for the RFID market and covers worldwide frequency bands. The transmit module operates in the 850 MHz – 960 MHz range, and has a 32.5 dBm output power. It uses a 3.6 supply voltage, and has a 0 - 7 dBm LO drive.

Tyco Electronics' M/A-COM MAIA-007851-000100, MAIA-007860-000100, MAIA-007859-000100 and MAIA-007775-000100 are available in a RoHS-compliant 6mm 28-lead PQFN (Power Quad Flat No-Lead) plastic packages. The MAIA-007028-000100 is available in RoHS-compliant lead-free land grid array packaging.

SOURCE: Cobham