TriQuint Introduces RF Packaged Products For Digital Radio, SATCOM

Hillsboro, OR -- TriQuint Semiconductor announced the availability of the first three packaged devices in its Multi-Function Circuit (MFC) family. These new products, initially released as die-level devices in November 2006, are now available in industry-standard packages.

TriQuint's new MFC products will debut at the 2007 IEEE MTT-S International Microwave Symposium in Honolulu, Hawaii (5th-7th June). These gallium arsenide (GaAs) integrated circuits (ICs) were developed for use in point-to-point (PTP) radio and satellite communications applications.

TriQuint's Networks Business Unit detailed its three-part vision for simplifying next-generation connectivity in a May 21st press release. "Our new MFC products embody that vision, which includes offering more integrated devices for size and cost-constrained applications and providing more high frequency packaged product options. Packaging gives new and existing customers greater access to our vast portfolio of leading die-level designs, which also ties to easier product access — the third part of our vision for simplifying connectivity," remarked TriQuint Networks Vice President Brian Balut.

TriQuint's three newly packaged products address OEM needs for frequency upconversion (amplification) in the transmit (Tx) and local oscillator chains for digital radio and satellite communications systems. Manufacturers can choose from a highly integrated module or separate discrete component functions to suit their individual assembly and PCB layout preferences.

The TGC4405-SM provides high integration for designs that specify RF upconversion, a local oscillator (LO) frequency doubler and output RF signal amplification together in a small, single product. Available as a separate packaged component is TriQuint's new TGC4402-SM that provides upconversion without an integral LO doubler or output amplifier. The TGC4405-SM and TGC4402-SM both employ single-ended designs and have no external balun requirement. The third new component, TriQuint's TGC4403-SM, is a millimeter wave frequency doubler that includes an output buffer amplifier.

"Our new designs respond to customers who want to buy these types of products from TriQuint, especially those who were not equipped to handle die-level devices or simply prefer packaged products. The devices' overall performance is exceptional and we offer a very competitive cost structure. Packaging appeals to a larger number of manufacturers by offering more choices and greater flexibility. Some find that packaged devices enable more design control, so these new MFCs are what they have been looking for," said TriQuint Product Marketing Manager Mike Tessaro.

SOURCE: TriQuint Semiconductor