Hybrid Microelectronics Packages Catalog
Source: Mini-Systems, Inc.
Founded in 1972, Mini-Systems, Inc., Electronic Package Division has been providing the electronics industry with the very highest quality hybrid microelectronic packages available. The Electronic Package Division is best known for supplying the hybrid alternative to plastic microelectronic packages; namely, our Alumina/Glass Sidewall packages. These packages meet military and space level quality requirements and exceed virtually all commercial needs.
access the Catalog!
Log In
Get unlimited access to:
Trend and Thought Leadership Articles
Case Studies & White Papers
Extensive Product Database
Members-Only Premium Content
Welcome Back! Please Log In to Continue.
X
Enter your credentials below to log in. Not yet a member of RF Globalnet? Subscribe today.
Subscribe to RF Globalnet
X
Subscribe to RF Globalnet
Mini-Systems, Inc.
This website uses cookies to ensure you get the best experience on our website. Learn more