Product/Service

GPPO™ Multi-position Block Series

Source: Corning Gilbert Inc.
Innovative packaging solution for GPPO™ that integrates the interfaces of sub-miniature, push-on, high performance, microwave interconnect systems
Innovative packaging solution for GPPO™ that integrates the interfaces of sub-miniature, push-on, high performance, microwave interconnect systems. Developed in response to industry demand for increased package density, lower weight, and performance at higher frequencies.

  • Minimum center-to-center spacing of 0.140" available for increased package density.
  • The GPPO™ right angle 6-position PCB block, Part No. B130-L95-01-6 weighs just 2.4 gms
  • RF Performance from DC to 65 GHz
  • Increased connection density = Smaller footprint
  • Eliminates assembly tolerance stack up
  • Simplifies system assembly and testing
  • Reduces weight
  • Can be securely fastened down for increased reliability
  • Stronger attachment to PCB
  • Cable versions have the following additional benefits:
    • Simplified cable harness management
    • Field replaceable cable mounts
    • Reduces or eliminates chances of mis-wiring

Click here to download the complete brochure in PDF Format.

Click Here To Download:
•Product Catalog: Microwave Push-On Interconnects