Electronic Packaging: Using EMI Material-Based Solutions
By David Garagnani, W. L. Gore & Associates, Inc.
When designing new printed circuit boards for new electronic devices, it is important to consider electromagnetic interference (EMI) shielding solutions early. One of the main issues encountered is when the individual components could pass EMI testing, but as the components are combined into subsystems or into the final product, the device under test (DUT) fails. Incorporating EMI shielding materials as part of an initial design is the most cost-effective way to prevent these last-minute issues during testing. Download the white paper for more on how to use electronic packaging and EMI material-based solutions in new circuit board designs.
Get unlimited access to:
Enter your credentials below to log in. Not yet a member of RF Globalnet? Subscribe today.