White Paper: Airstrip™ — An Innovative Transmission Line Technology In Support Of Hi-Rel Space Qualified Packaging

By Shaun Moore and Ken Greenwood, TRM Microwave

Abstract:

Mechanical integration of microwave components is often left as the last step while addressing manufacturing considerations for system-level designs. In many cases, the electrical design is analyzed, bread boards are built, electrical designs verified, and then it is left to the mechanical engineers to fit the various components into the final package. This paper shows how component manufacturers can help solve system-level packaging problems using Airstrip technology. By means of an example, engineered by TRM Microwave, this white paper will show that passive components are more than just off-the-shelf commodity items, and can be effectively integrated into practical system-level designs that can benefit your program.