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By Dr. Eric Bogatin of Bogatin Enterprises, Lambert Simonovich of Nortel, and Sanjeev Gupta and Mike Resso, of Agilent Technologies

Abstract

Accurate, verified models for vias in a multilayer circuit board are necessary to predict link performance in the GHz regime. This paper describes the methodology of using measurements on a test vehicle to build a high bandwidth, scalable model of long vias which includes the through and stub effects which can be used for system simulation. This simple model also provides valuable insight into the root cause of performance limits and how to overcome them.

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•White Paper: Practical Analysis Of Backplane Vias