Articles
3-D EM Simulation In The Design Flow Of High-Speed Multi-Pin Connectors
November 6, 2009
•White Paper: 3-D EM Simulation In The Design Flow Of High-Speed Multi-Pin Connectors
By Thomas Gneiting, AdMOS GmbH, and Adrian Scott, CST AG
This article describes the design flow for a high speed connector using several simulation tools. The goal is to enable its first pass design without time-intensive and costly iteration steps.
In addition to other simulation tools, CST MICROWAVE STUDIO® (CST MWS) is used during various stages of the design process to find fundamental design parameters and to predict the behavior of a complete telecommunication system. A new high speed multi pin connector has to enable a data transmission rate of at least 10Gbit/s in a communication system, where two daughter cards are connected via a backplane. The connections should be point-to-point connections applying differential signal trace layout. Other technical requirements include:
- 100 Ohm differential impedance.
- SMT interface to printed circuit board.
- Extreme shielding to achieve a minimum of crosstalk between differential signal pairs.
- Minimum signal skew between the two contacts of a differential signal pair.
- Economical and easy trace routing.
•White Paper: 3-D EM Simulation In The Design Flow Of High-Speed Multi-Pin Connectors
