News | June 30, 2017

Think Bigger! IDS And EMA Invite You To IEEE EMC 2017

Source: IDS Ingegneria Dei Sistemi S.p.A.
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Think Bigger! IDS And EMA Invite You To IEEE EMC 2017

Let’s face it, there are many challenges when dealing with EMC for an integrator or a big platform. The first challenge regards working with massive CAD files and preparing for simulation; the second concerns performing analysis for multiple environments across a wide band of spectrum; the third is about ensuring compatibility and performance when the design information provided by partners is limited. IDS Ingegneria Dei Sistemi and Electro Magnetic Applications, Inc. overcame them, and we invite you to join us to discuss EM modeling for EMC at the 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, one of the most important conferences in this field. The event, sponsored by the IEEE Electromagnetic Compatibility Society (EMC-S), will be held in Washington D.C. from August 7 to August 11. 

EMA and IDS have jointly developed advanced simulation tools focused on large platform EM modeling for EMC. The two companies have CAE tools that automate the tedious parts of your CAD cleaning and defeaturing. By letting EMA and IDS consulting teams know your geometry headache, they can see if it can be done by an algorithm. The two companies have collected solvers and subject matter experts in all aspects of large platform EMC: lightning, antenna siting, external RF effects, space plasma environments, and many more. Also, practical and smart algorithms can help you work quickly and accurately with the minimum system description of antennas and platforms.

At IEEE EMC 2017, EMA and IDS will present two workshops: one on lightning and the other on Space Environment Plasma EMC. There will also be a live software demonstration and another event with food and drinks.

Live software demo: “Comprehensive Space Plasma EMC Analysis Using a Single Model”

Space plasmas present many risks to space vehicles, ranging from antenna pattern distortion to surface charging to box level transient coupling. The modern use of ceramics and other insulating materials in space vehicle platforms makes numerical EMC analysis an important part of the design process. The ability to perform a wide array of numerical analyses from a single geometric model provides great efficiency and flexibility for a space program. Different materials and other design variations can be incorporated into the model to obtain a comprehensive view of the impact of these modifications on overall vehicle EMC risk. This demonstration will present a quantitative assessment of EMC risks due to space plasma environments. Emphasis will be on using a single geometric model to perform a wide array of assessments, including:

Think bigger! To contact EMA and IDS consulting teams and meet them at the IEEE EMC 2017 symposium, please send an e-mail to Tim McDonald, PhD: tim@ema3d.com

SOURCE: IDS Ingegneria Dei Sistemi S.p.A.

IDS Ingegneria Dei Sistemi S.p.A.