Datasheet | October 5, 2017

Semiconductor Technology Overview

Source: Micro Systems Technologies

MST offers various customized packaging solutions for a wide range of base materials, I/O configurations and housing types. The newest technology development enables the production of SDBGAs (Stacked Die Ball Grid Arrays) in small and medium-sized volumes applying transfer molding technology, laser marking and singulation. All mission critical functions are accessible within the group to provide customized solutions. Capabilities for providing miniaturized packages include design, substrate manufacturing, component selection and validation as well as all major packaging processes.  For more information download the overview datasheet.

VIEW THE DATASHEET!
Signing up provides unlimited access to:
Signing up provides unlimited access to:
  • Trend and Leadership Articles
  • Case Studies
  • Extensive Product Database
  • Premium Content
HELLO. PLEASE LOG IN. X

Not yet a member of RF Globalnet? Register today.

ACCOUNT SIGN UP X
Please fill in your account details
Login Information
ACCOUNT SIGN UP

Subscriptions

Sign up for the newsletter that brings you the industry's latest news, technologies, trends and products.

You might also want to: