Semiconductor Technology Overview

MST offers various customized packaging solutions for a wide range of base materials, I/O configurations and housing types. The newest technology development enables the production of SDBGAs (Stacked Die Ball Grid Arrays) in small and medium-sized volumes applying transfer molding technology, laser marking and singulation. All mission critical functions are accessible within the group to provide customized solutions. Capabilities for providing miniaturized packages include design, substrate manufacturing, component selection and validation as well as all major packaging processes.  For more information download the overview datasheet.