Product/Service

RFIC Packaging And Assembly Services

Source: Cobham

RFIC Packaging And Assembly Services
From prototypes to production, M/A-COM provides time-to-market solutions in the design, manufacture, and test of RFIC multi-chip modules for the commercial and defense markets. M/A-COM provides U.S. based packaging and testing services for ceramic, BGA, LGA, and chip scale services

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Product Overview: RFIC Packaging And Assembly Services

From prototypes to production, M/A-COM provides time-to-market solutions in the design, manufacture, and test of RFIC multi-chip modules for the commercial and defense markets. M/A-COM provides U.S. based packaging and testing services for ceramic, BGA, LGA, and chip scale services.

Process Capabilities

  • Auto Epoxy & Eutectic Die Attach
  • Auto Ball & Wedge Bonding
  • Low Volume SMT (0201 Placement)
  • Eutectic & B-Stage Lid Seal
  • Fine & Gross Leak Testing
  • Auto Liquid Encapsulation
  • Laser Mark & Auto Scribe
  • Manual & Auto Solder Ball Attach
  • Auto Saw and Trim & Form
  • Auto Test
  • Environmental Screening

Click Here To Download:
Product Overview: RFIC Packaging And Assembly Services