RFIC Packaging And Assembly Services
Source: Cobham
From prototypes to production, M/A-COM provides time-to-market solutions in the design, manufacture, and test of RFIC multi-chip modules for the commercial and defense markets. M/A-COM provides U.S. based packaging and testing services for ceramic, BGA, LGA, and chip scale services
Click Here To Download:
•Product Overview: RFIC Packaging And Assembly Services
From prototypes to production, M/A-COM provides time-to-market solutions in the design, manufacture, and test of RFIC multi-chip modules for the commercial and defense markets. M/A-COM provides U.S. based packaging and testing services for ceramic, BGA, LGA, and chip scale services.
•Product Overview: RFIC Packaging And Assembly Services
•Product Overview: RFIC Packaging And Assembly Services
From prototypes to production, M/A-COM provides time-to-market solutions in the design, manufacture, and test of RFIC multi-chip modules for the commercial and defense markets. M/A-COM provides U.S. based packaging and testing services for ceramic, BGA, LGA, and chip scale services.
Process Capabilities
- Auto Epoxy & Eutectic Die Attach
- Auto Ball & Wedge Bonding
- Low Volume SMT (0201 Placement)
- Eutectic & B-Stage Lid Seal
- Fine & Gross Leak Testing
- Auto Liquid Encapsulation
- Laser Mark & Auto Scribe
- Manual & Auto Solder Ball Attach
- Auto Saw and Trim & Form
- Auto Test
- Environmental Screening
Click Here To Download:
•Product Overview: RFIC Packaging And Assembly Services
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