AD350A: RF & Microwave Laminate

Arlon's Next Generation "AD350A" is a woven fiberglass reinforced, ceramic filled, PTFE-based composite material for use as a printed circuit board substrate. It has been redeveloped to provide higher thermal conductivity, lower thermal expansion and better interlaminar and copper bond integrity than the original AD350.

Its higher thermal conductivity and low CTE promote its use in higher power designs, where temperature extremes are normal and heat rejection is a primary consideration. Its lower CTE offers better component attachment reliability as well.

AD350A is compatible with the processing used for standard PTFE based printed circuit board substrates. Its low Z-axis thermal expansion improves plated through hole reliability compared to typical PTFE based laminates. Low XY expansion improves BGA solder-joint reliability.

Features:

• Tighter Dielectric Tolerance
• Low Z-Axis thermal Expansion
• Ceramic Filled PTFE
• High Thermal Conductivity
• Large Panel Size

Benefits:

• Higher Consistency of Performance
• Superior PTH adhesion
• Heat Dissipation and Management
• Multiple boards/panel; larger antenna formats

Typical Applications:

• High Power Applications
• Low Noise Amplfiers (LNAs)
• Low Noise Blocks (LNBs)
• Filters and Couplers