RF Board Connector: Footprint Optimization

By HUBER+SUHNER

Continuous demands for higher data rates are pushing frequency boundaries and performance levels of RF components used in test setups. For design validation testing (DVT), test components must be “electrically transparent” to ensure a reliable characterization of the device under test (DUT). While low frequency/low data rate applications can use a generic footprint for RF board connectors, modern bandwidths that support data rate of 56 Gbps and beyond require an optimized footprint designed and matched to a specific board stackup to ensure best performance in the desired frequency range. Download the full application note for more on how to use optimize the footprint in RF board connectors.